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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-83-316-41-012101

116-83-316-41-012101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-83-316-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
18-0513-10T

18-0513-10T

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0513-10T

数据表

0513 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
03-0503-21

03-0503-21

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0503-21

数据表

0503 Bulk Active SIP 3 (1 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
03-0503-31

03-0503-31

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0503-31

数据表

0503 Bulk Active SIP 3 (1 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
22-4518-10T

22-4518-10T

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4518-10T

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
212-1-14-003

212-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech

0 -
212-1-14-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
HLS-0203-T-10

HLS-0203-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0203-T-10

数据表

HLS Tube Active SIP 6 (2 x 3) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
110-83-628-41-001101

110-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-628-41-001101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-628-41-001151

110-83-628-41-001151

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-628-41-001151

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1-822473-7

1-822473-7

CONN SOCKET PLCC 84POS TIN

TE Connectivity AMP Connectors

0 -
1-822473-7

数据表

- Box Obsolete PLCC 84 (4 x 21) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Thermoplastic 100.0µin (2.54µm) Phosphor Bronze
400-028-050

400-028-050

CONN IC DIP SOCKET 28POS GOLD

3M

0 -
400-028-050

数据表

400 Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 8.00µin (0.203µm) - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) - Gold - 8.00µin (0.203µm) -
06-6513-11

06-6513-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-6513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
12-0518-11

12-0518-11

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0518-11

数据表

518 Bulk Active SIP 12 (1 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
12-1518-11

12-1518-11

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
D0924-42

D0924-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

0 -
D0924-42

数据表

D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
822-AG11D-ESL-LF

822-AG11D-ESL-LF

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

0 -
822-AG11D-ESL-LF

数据表

800 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Flash Copper
116-87-316-41-001101

116-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-87-316-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-310-41-004101

116-83-310-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-310-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-ICS-254-14-TT50

A-ICS-254-14-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0 -
A-ICS-254-14-TT50

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 78.7µin (2.00µm) Brass
116-87-322-41-012101

116-87-322-41-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-322-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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