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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-83-314-41-002101

116-83-314-41-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-83-314-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-428-41-001101

110-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-428-41-001101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
16-0513-10

16-0513-10

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0513-10

数据表

0513 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
19-0518-10H

19-0518-10H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
19-0518-10H

数据表

518 Bulk Active SIP 19 (1 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
123-87-320-41-001101

123-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
123-87-320-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
D95022-42

D95022-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

0 -
D95022-42

数据表

D95 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
116-87-424-41-018101

116-87-424-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-424-41-018101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
612-83-318-41-001101

612-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
612-83-318-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICF-314-STL-O-TR

ICF-314-STL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-314-STL-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
BU180Z-178-HT

BU180Z-178-HT

CONN IC DIP SOCKET 18POS GOLD

On Shore Technology Inc.

0 -
BU180Z-178-HT

数据表

BU-178HT Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Copper Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
614-87-624-31-012101

614-87-624-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
614-87-624-31-012101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-314-41-011101

116-87-314-41-011101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-87-314-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-312-41-004101

116-87-312-41-004101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-87-312-41-004101

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
346-43-105-41-013000

346-43-105-41-013000

CONN SOCKET SIP 5POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-105-41-013000

数据表

346 Tube Active SIP 5 (1 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-314-ZSTT

ICA-314-ZSTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-ZSTT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
110-83-320-41-105101

110-83-320-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-83-320-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-422-41-117101

114-83-422-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
114-83-422-41-117101

数据表

114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
12-0513-10

12-0513-10

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0513-10

数据表

0513 Bulk Active SIP 12 (1 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0108-S-2

HLS-0108-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0108-S-2

数据表

HLS Bulk Active SIP 8 (1 x 8) Gold - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
110-87-642-41-005101

110-87-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
110-87-642-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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