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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
146-87-318-41-035101

146-87-318-41-035101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
146-87-318-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-87-318-41-036101

146-87-318-41-036101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
146-87-318-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICF-314-STL-I-TR

ICF-314-STL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-314-STL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
612-87-424-41-001101

612-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
612-87-424-41-001101

数据表

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
612-87-328-41-001101

612-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
612-87-328-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-032-09-041101

510-83-032-09-041101

CONN SOCKET PGA 32POS GOLD

Preci-Dip

0 -
510-83-032-09-041101

数据表

510 Bulk Active PGA 32 (9 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-320-41-134191

114-83-320-41-134191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
114-83-320-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP050-1X28-157B

SIP050-1X28-157B

1X28-157B-SIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X28-157B

数据表

SIP050-1x Bulk Active SIP 28 (1 x 28) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
0009483031

0009483031

CONN SOCKET TRANSIST TO-220 3POS

Molex

0 -
0009483031

数据表

- Bulk Obsolete Transistor, TO-220 3 (Rectangular) Tin 100.0µin (2.54µm) Brass Through Hole Closed Frame - Solder - -40°C ~ 80°C Tin Polyamide (PA66), Nylon 6/6 100.0µin (2.54µm) Brass
828-AG11D-ESL

828-AG11D-ESL

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
828-AG11D-ESL

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
DIP628-014B

DIP628-014B

DIP628-014B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
DIP628-014B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
116-87-318-41-008101

116-87-318-41-008101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-87-318-41-008101

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-87-632-41-134191

114-87-632-41-134191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
114-87-632-41-134191

数据表

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
122-87-420-41-001101

122-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
122-87-420-41-001101

数据表

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
410-83-224-10-001101

410-83-224-10-001101

CONN ZIG-ZAG 24POS GOLD

Preci-Dip

0 -
410-83-224-10-001101

数据表

410 Bulk Active Zig-Zag, Left Stackable 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
410-83-224-10-002101

410-83-224-10-002101

CONN ZIG-ZAG 24POS GOLD

Preci-Dip

0 -
410-83-224-10-002101

数据表

410 Bulk Active Zig-Zag, Right Stackable 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-87-056-09-041101

510-87-056-09-041101

CONN SOCKET PGA 56POS GOLD

Preci-Dip

0 -
510-87-056-09-041101

数据表

510 Bulk Active PGA 56 (9 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
10-2511-10

10-2511-10

10-PIN SOLDER TAIL IC SOCKET

Aries Electronics

0 -
10-2511-10

数据表

511 - Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-4518-10

20-4518-10

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4518-10

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-3518-00

14-3518-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3518-00

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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