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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-87-424-41-003101

116-87-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-424-41-003101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
16-3511-10WR

16-3511-10WR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

0 -
16-3511-10WR

数据表

511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
SIP050-1X25-160B

SIP050-1X25-160B

1X25-160B-SIP SOCKET 25 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X25-160B

数据表

SIP050-1x Bulk Active SIP 25 (1 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
121-83-316-41-001101

121-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
121-83-316-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP050-1X32-157B

SIP050-1X32-157B

1X32-157B-SIP SOCKET 32 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X32-157B

数据表

SIP050-1x Bulk Active SIP 32 (1 x 32) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
116-87-318-41-009101

116-87-318-41-009101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-87-318-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
C8114-04

C8114-04

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

0 -
C8114-04

数据表

Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
08-4513-10H

08-4513-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-4513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
10-2513-11

10-2513-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-2513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
17-0513-10

17-0513-10

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0513-10

数据表

0513 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
22-0518-10T

22-0518-10T

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0518-10T

数据表

518 Bulk Active SIP 22 (1 x 22) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
24-0518-10

24-0518-10

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
24-0518-10

数据表

518 Bulk Active SIP 24 (1 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-83-320-41-105161

110-83-320-41-105161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-83-320-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
117-83-624-41-005101

117-83-624-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
117-83-624-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 50-HZL/01-TT

AR 50-HZL/01-TT

SOCKET

Assmann WSW Components

0 -
AR 50-HZL/01-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
ICA-308-ZSST

ICA-308-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-ZSST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled - Brass
124-83-312-41-002101

124-83-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
124-83-312-41-002101

数据表

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
08-0513-11

08-0513-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0513-11

数据表

0513 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
116-83-314-41-009101

116-83-314-41-009101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-83-314-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
612-83-420-41-001101

612-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
612-83-420-41-001101

数据表

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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