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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
614-87-324-31-012101

614-87-324-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
614-87-324-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICO-316-STT

ICO-316-STT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-STT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
SIP050-1X23-160B

SIP050-1X23-160B

1X23-160B-SIP SOCKET 23 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X23-160B

数据表

SIP050-1x Bulk Active SIP 23 (1 x 23) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
1-822473-6

1-822473-6

CONN SOCKET PLCC 68POS TIN

TE Connectivity AMP Connectors

0 -
1-822473-6

数据表

- Box Obsolete PLCC 68 (4 x 17) Tin - Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Thermoplastic - Phosphor Bronze
08-0513-11H

08-0513-11H

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0513-11H

数据表

0513 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
11-0513-10H

11-0513-10H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0513-10H

数据表

0513 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0204-TT-11

HLS-0204-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0204-TT-11

数据表

HLS Tube Active SIP 8 (2 x 4) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
09-0518-00

09-0518-00

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0518-00

数据表

518 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0202-G-11

HLS-0202-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0202-G-11

数据表

HLS Tube Active SIP 4 (2 x 2) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
2-1571586-3

2-1571586-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
2-1571586-3

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 25.0µin (0.63µm) Copper
115-87-636-41-001101

115-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
115-87-636-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-610-41-004101

116-87-610-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-610-41-004101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-306-41-013101

116-83-306-41-013101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-013101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-624-41-001101

115-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
115-83-624-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 22-HZL/01-TT

AR 22-HZL/01-TT

SOCKET

Assmann WSW Components

0 -
AR 22-HZL/01-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
08-2511-10

08-2511-10

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0 -
08-2511-10

数据表

511 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
06-0517-90C

06-0517-90C

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0517-90C

数据表

0517 Bulk Active SIP 6 (1 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
114-83-322-41-117101

114-83-322-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
114-83-322-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-624-41-018101

116-87-624-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-624-41-018101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-318-41-018101

116-83-318-41-018101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-83-318-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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