| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 附件方式 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HF20GHEATSINK TO-220 TAB/CLIP-ON Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 0.790" (20.07mm) | 1.102" (28.00mm) | - | 0.787" (19.99mm) | Clip and PC Pin | 1.0W @ 20°C | 6.00°C/W @ 400 LFM | 13.10°C/W | Aluminum | Black Anodized |
|
6382BGBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-218, TO-220, TO-247, Multiwatt (Dual) | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | - | 1.000" (25.40mm) | Bolt On and PC Pin | 2.0W @ 20°C | 3.50°C/W @ 200 LFM | 4.20°C/W | Aluminum | Black Anodized |
|
2283BBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | BGA | Square, Fins | 0.655" (16.64mm) | 0.655" (16.64mm) | - | 0.265" (6.73mm) | Thermal Tape, Adhesive (Not Included) | 1.0W @ 40°C | 17.50°C/W @ 300 LFM | - | Aluminum | Black Anodized |
|
373024B00032GBGA HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | Assorted (BGA, LGA, CPU, ASIC...) | - | - | - | - | 0.350" (8.89mm) | Thermal Tape, Adhesive (Included) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 33.30°C/W | Aluminum | Black Anodized |
|
373024B00034GBGA HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | Assorted (BGA, LGA, CPU, ASIC...) | - | - | - | - | 0.350" (8.89mm) | Thermal Tape, Adhesive (Included) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 33.30°C/W | Aluminum | Black Anodized |
|
580100W00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Top Mount | 8-DIP | Rectangular, Fins | 0.562" (14.27mm) | 0.600" (15.24mm) | - | 0.450" (11.43mm) | Press Fit, Slide On | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 30.00°C/W | Aluminum | Black Anodized |
|
374824B00035GBGA HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | Assorted (BGA, LGA, CPU, ASIC...) | - | - | - | - | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 30°C | 5.00°C/W @ 200 LFM | 12.00°C/W | Aluminum | Black Anodized |
|
6400B-P2GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | - | 1.000" (25.40mm) | Bolt On and PC Pin | 4.0W @ 20°C | 1.50°C/W @ 400 LFM | 2.70°C/W | Aluminum | Black Anodized |
|
533302B02551GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 2.500" (63.50mm) | 1.375" (34.93mm) | - | 0.500" (12.70mm) | Clip and PC Pin | 8.0W @ 60°C | 2.00°C/W @ 800 LFM | 8.00°C/W | Aluminum | Black Anodized |
|
529701B02100GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-218 | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | 1.000" (25.40mm) | Bolt On and PC Pin | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.50°C/W | Aluminum | Black Anodized |