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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
HF20G

HF20G

HEATSINK TO-220 TAB/CLIP-ON

Boyd Laconia, LLC

0 -
HF20G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.790" (20.07mm) 1.102" (28.00mm) - 0.787" (19.99mm) Clip and PC Pin 1.0W @ 20°C 6.00°C/W @ 400 LFM 13.10°C/W Aluminum Black Anodized
6382BG

6382BG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
6382BG

数据表

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247, Multiwatt (Dual) Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 2.0W @ 20°C 3.50°C/W @ 200 LFM 4.20°C/W Aluminum Black Anodized
2283B

2283B

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
2283B

数据表

- Bulk Active Board Level BGA Square, Fins 0.655" (16.64mm) 0.655" (16.64mm) - 0.265" (6.73mm) Thermal Tape, Adhesive (Not Included) 1.0W @ 40°C 17.50°C/W @ 300 LFM - Aluminum Black Anodized
373024B00032G

373024B00032G

BGA HEAT SINK

Boyd Laconia, LLC

0 -
373024B00032G

数据表

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) - - - - 0.350" (8.89mm) Thermal Tape, Adhesive (Included) 1.5W @ 50°C 10.00°C/W @ 200 LFM 33.30°C/W Aluminum Black Anodized
373024B00034G

373024B00034G

BGA HEAT SINK

Boyd Laconia, LLC

0 -
373024B00034G

数据表

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) - - - - 0.350" (8.89mm) Thermal Tape, Adhesive (Included) 1.5W @ 50°C 10.00°C/W @ 200 LFM 33.30°C/W Aluminum Black Anodized
580100W00000G

580100W00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
580100W00000G

数据表

- Bulk Active Top Mount 8-DIP Rectangular, Fins 0.562" (14.27mm) 0.600" (15.24mm) - 0.450" (11.43mm) Press Fit, Slide On 1.0W @ 30°C 8.00°C/W @ 500 LFM 30.00°C/W Aluminum Black Anodized
374824B00035G

374824B00035G

BGA HEAT SINK

Boyd Laconia, LLC

0 -
374824B00035G

数据表

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) - - - - 0.984" (25.00mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 5.00°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
6400B-P2G

6400B-P2G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
6400B-P2G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 4.0W @ 20°C 1.50°C/W @ 400 LFM 2.70°C/W Aluminum Black Anodized
533302B02551G

533302B02551G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
533302B02551G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.500" (63.50mm) 1.375" (34.93mm) - 0.500" (12.70mm) Clip and PC Pin 8.0W @ 60°C 2.00°C/W @ 800 LFM 8.00°C/W Aluminum Black Anodized
529701B02100G

529701B02100G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
529701B02100G

数据表

- Bulk Active Board Level, Vertical TO-218 Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
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