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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
6239BG

6239BG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
6239BG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.159" (29.44mm) 1.005" (25.53mm) - 0.610" (15.49mm) Clip 2.0W @ 40°C 6.00°C/W @ 600 LFM 13.60°C/W Aluminum Black Anodized
6381BG

6381BG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
6381BG

数据表

- Bulk Active Board Level, Vertical TO-220, TO-218 Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 6.0W @ 50°C 3.50°C/W @ 200 LFM 5.80°C/W Aluminum Black Anodized
550202D00000G

550202D00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
550202D00000G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) Bolt On and PC Pin 1.5W @ 20°C 3.00°C/W @ 700 LFM 12.40°C/W - Tin
567103B00000

567103B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
567103B00000

数据表

- Bulk Active - TO-3 - - - - - - - - - Aluminum Black Anodized
533402B02500G

533402B02500G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
533402B02500G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 10.0W @ 50°C 3.00°C/W @ 200 LFM 5.00°C/W Aluminum Black Anodized
533002B02500G

533002B02500G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
533002B02500G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.00°C/W Aluminum Black Anodized
374424B00032G

374424B00032G

BGA HEAT SINK

Boyd Laconia, LLC

0 -
374424B00032G

数据表

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) - - - - 0.710" (18.03mm) Thermal Tape, Adhesive (Included) 4.0W @ 80°C 5.00°C/W @ 350 LFM 20.30°C/W Aluminum Black Anodized
592502B00000G

592502B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
592502B00000G

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) Bolt On 1.5W @ 40°C 10.00°C/W @ 200 LFM 22.00°C/W Aluminum Black Anodized
530801B05150G

530801B05150G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
530801B05150G

数据表

- Bulk Active Board Level, Vertical TO-218, TO-247 Rectangular, Fins 1.840" (46.74mm) 0.490" (12.44mm) - 1.750" (44.45mm) Clip and PC Pin 4.0W @ 30°C 1.00°C/W @ 700 LFM 6.30°C/W Aluminum Black Anodized
533201B02500G

533201B02500G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
533201B02500G

数据表

- Bulk Active Board Level, Vertical TO-218, TO-247 Rectangular, Fins 2.000" (50.80mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 3.0W @ 30°C 3.00°C/W @ 400 LFM 9.00°C/W Aluminum Black Anodized
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