富聪科技订单满¥1000免运费
关注我们:

散热器

制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
513002B00000

513002B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
513002B00000

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
550102B00000

550102B00000

HEATSINK TO-220 TAB BLACK

Boyd Laconia, LLC

0 -
550102B00000

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) Bolt On and PC Pin 1.5W @ 20°C 4.00°C/W @ 300 LFM 12.40°C/W Aluminum Black Anodized
574402B00000G

574402B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
574402B00000G

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip 3.0W @ 60°C 6.00°C/W @ 600 LFM 23.20°C/W Aluminum Black Anodized
574802B00000G

574802B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
574802B00000G

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 0.900" (22.86mm) 1.020" (25.91mm) - 0.420" (10.67mm) Clip 3.0W @ 60°C 6.00°C/W @ 500 LFM 20.40°C/W Aluminum Black Anodized
529902B00000

529902B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
529902B00000

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On 6.0W @ 30°C 1.50°C/W @ 500 LFM 4.50°C/W Aluminum Black Anodized
7024BG

7024BG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
7024BG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.620" (41.15mm) 2.000" (50.80mm) - 0.750" (19.05mm) Bolt On 9.0W @ 60°C 4.00°C/W @ 200 LFM 5.60°C/W Aluminum Black Anodized
506902B00000G

506902B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
506902B00000G

数据表

Hat Section 5070 Bulk Active Board Level TO-220 Rectangular, Fins 0.700" (17.78mm) 1.250" (31.75mm) - 0.375" (9.52mm) Bolt On 1.0W @ 20°C 6.00°C/W @ 600 LFM 20.00°C/W Aluminum Black Anodized
375324B00035G

375324B00035G

HEATSINK 10.2X10.2X10.2MM W/ADH

Boyd Laconia, LLC

0 -
375324B00035G

数据表

- Bulk Active - BGA Square, Pin Fins 0.401" (10.19mm) 0.401" (10.20mm) - 0.400" (10.16mm) Thermal Tape, Adhesive (Included) 0.5W @ 40°C 21.20°C/W @ 200 LFM 71.40°C/W Aluminum Black Anodized
373324M00000G

373324M00000G

HEATSINK BGA W/OUT AD-TAPE

Boyd Laconia, LLC

0 -
373324M00000G

数据表

- Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Square, Pin Fins 1.472" (37.39mm) 1.472" (37.39mm) - 0.236" (6.00mm) Thermal Tape, Adhesive (Not Included) - - - Aluminum Green Anodized
335214B00000G

335214B00000G

HEAT SINK

Boyd Laconia, LLC

0 -
335214B00000G

数据表

- Bulk Active Top Mount BGA Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Included) - 5.30°C/W @ 200 LFM 1.00°C/W Aluminum Black Anodized
共 748 条记录«上一页1... 5859606162636465...75下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户