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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
501000B00000G

501000B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
501000B00000G

数据表

- Bulk Active Top Mount 14-DIP and 16-DIP Rectangular, Fins 0.750" (19.05mm) 0.604" (15.34mm) - 0.212" (5.39mm) Thermal Tape, Adhesive (Not Included) 0.6W @ 40°C 60.00°C/W @ 100 LFM 60.00°C/W Aluminum Black Anodized
335214B00032G

335214B00032G

BGA HEAT SINK

Boyd Laconia, LLC

0 -
335214B00032G

数据表

- Bulk Active Top Mount BGA Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.390" (9.91mm) Thermal Tape, Adhesive (Included) - 5.30°C/W @ 200 LFM 10.00°C/W Aluminum Black Anodized
550402B00000

550402B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
550402B00000

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) Bolt On and PC Pin 4.0W @ 40°C 4.00°C/W @ 300 LFM 11.20°C/W Aluminum Black Anodized
591202B03700G

591202B03700G

HEATSINK TO-220 CLIP-ON BLACK

Boyd Laconia, LLC

0 -
591202B03700G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip and PC Pin 1.0W @ 40°C 16.00°C/W @ 200 LFM 26.80°C/W Aluminum Black Anodized
2262R

2262R

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
2262R

数据表

- Bulk Active Top Mount TO-5 Cylindrical - - 0.318" (8.07mm) ID, 0.602" (15.29mm) OD 0.250" (6.35mm) Bolt On 1.6W @ 80°C 30.00°C/W @ 200 LFM - Aluminum Red Anodized
519703B00000G

519703B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
519703B00000G

数据表

- Bulk Active Board Level TO-3 Rhombus 1.550" (39.37mm) 1.550" (39.37mm) - 1.500" (38.10mm) Bolt On 6.0W @ 30°C 2.00°C/W @ 400 LFM 4.80°C/W Aluminum Black Anodized
575400B00000G

575400B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
575400B00000G

数据表

- Bulk Active Top Mount TO-92 Rectangular, Fins 0.602" (15.29mm) - - 1.220" (31.00mm) Press Fit 0.5W @ 20°C 20.00°C/W @ 200 LFM 40.00°C/W Aluminum Black Anodized
575502B00000G

575502B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
575502B00000G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) Bolt On and PC Pin 1.5W @ 40°C 6.00°C/W @ 400 LFM 24.00°C/W Aluminum Black Anodized
374524B00032G

374524B00032G

BGA HEAT SINK

Boyd Laconia, LLC

0 -
374524B00032G

数据表

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) - - - - 0.984" (25.00mm) Thermal Tape, Adhesive (Included) 4.0W @ 70°C 4.00°C/W @ 400 LFM 16.50°C/W Aluminum Black Anodized
529801B00000

529801B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
529801B00000

数据表

- Bulk Active Board Level TO-218 Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On 5.0W @ 30°C 3.00°C/W @ 200 LFM 5.00°C/W Aluminum Black Anodized
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