| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 附件方式 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
EA-230-H245-T710EA-230-H245-T710 Boyd Laconia, LLC |
0 | - |
|
数据表 |
EA-230 | Bulk | Active | Top Mount | BGA, FPGA | Square, Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | - | 0.965" (24.50mm) | Clip | - | 10.10°C/W @ 200 LFM | 31.90°C/W | Aluminum | Black Anodized |
|
6038BGBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | 0.500" (12.70mm) | Clip and PC Pin | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | 18.00°C/W | Aluminum | Black Anodized |
|
2281BBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | Aluminum | Black Anodized |
|
|
575002D00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | 0.500" (12.70mm) | Bolt On and PC Pin | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | 13.60°C/W | - | Tin |
|
4860 REV ITHM,4860 REV I Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
519903B00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | TO-3 | Rhombus | 1.550" (39.37mm) | 1.550" (39.37mm) | - | 2.000" (50.80mm) | Bolt On | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 4.20°C/W | Aluminum | Black Anodized |
|
EA-425-H125-T710STD,EA-425-H125-T710, CLIP ATTAC Boyd Laconia, LLC |
0 | - |
|
数据表 |
EA-425 | Bulk | Active | Top Mount | BGA, FPGA | Square, Fins | 1.673" (42.50mm) | 1.673" (42.50mm) | - | 0.492" (12.50mm) | Clip | - | 11.40°C/W @ 200 LFM | 24.50°C/W | Aluminum | Black Anodized |
|
EA-425-H175-T710STD,EA-425-H175-T710, CLIP ATTAC Boyd Laconia, LLC |
0 | - |
|
数据表 |
EA-425 | Bulk | Active | Top Mount | BGA, FPGA | Square, Fins | 1.673" (42.50mm) | 1.673" (42.50mm) | - | 0.689" (17.50mm) | Clip | - | 8.80°C/W @ 200 LFM | 18.70°C/W | Aluminum | Black Anodized |
|
6322BGHEATSINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
2601006001 REV C2601006001, REV C Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |