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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
574802B03300G

574802B03300G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
574802B03300G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.900" (22.86mm) 1.020" (25.91mm) - 0.420" (10.67mm) Clip and PC Pin 3.0W @ 60°C 6.00°C/W @ 500 LFM 20.40°C/W Aluminum Black Anodized
EA-230-H145-T710

EA-230-H145-T710

STD,EA-230-H145-T710, CLIP ATTAC

Boyd Laconia, LLC

0 -
EA-230-H145-T710

数据表

EA-230 Bulk Active Top Mount BGA, FPGA Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.571" (14.50mm) Clip - 15.70°C/W @ 200 LFM 44.20°C/W Aluminum Black Anodized
533202B02551G

533202B02551G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
533202B02551G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.003" (50.88mm) 1.375" (34.93mm) - 0.500" (12.70mm) Clip and PC Pin 3.0W @ 30°C 3.00°C/W @ 400 LFM 9.00°C/W Aluminum Black Anodized
EA-270-H125-T710

EA-270-H125-T710

STD,EA-270-H125-T710, CLIP ATTAC

Boyd Laconia, LLC

0 -
EA-270-H125-T710

数据表

EA-270 Bulk Active Top Mount BGA, FPGA Square, Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.492" (12.50mm) Clip - 15.80°C/W @ 200 LFM 42.80°C/W Aluminum Black Anodized
523002D00000G

523002D00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
523002D00000G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) Bolt On and PC Pin 1.0W @ 20°C 6.00°C/W @ 300 LFM 13.60°C/W - Tin
6230DG-CU

6230DG-CU

6230DG-CU

Boyd Laconia, LLC

0 -
6230DG-CU

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 0.500" (12.70mm) - 1.180" (29.97mm) Bolt On and PC Pin 1.0W @ 20°C 4.00°C/W @ 600 LFM 12.50°C/W Copper Tin
EA-230-H195-T710

EA-230-H195-T710

STD,EA-230-H195-T710, CLIP ATTAC

Boyd Laconia, LLC

0 -
EA-230-H195-T710

数据表

EA-230 Bulk Active Top Mount BGA, FPGA Square, Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.768" (19.50mm) Clip - 12.20°C/W @ 200 LFM 36.80°C/W Aluminum Black Anodized
6239B-MTG

6239B-MTG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
6239B-MTG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.159" (29.44mm) 1.005" (25.53mm) - 0.610" (15.49mm) Clip and PC Pin 2.0W @ 40°C 6.00°C/W @ 600 LFM 13.60°C/W Aluminum Black Anodized
6380B

6380B

THM,17500B-1G REV H

Boyd Laconia, LLC

0 -
6380B

数据表

- Bulk Active Board Level, Vertical TO-218, TO-220 Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 1.000" (25.40mm) Bolt On and PC Pin 2.0W @ 20°C 3.5°C/W @ 200 LFM 6.80°C/W Aluminum Black Anodized
241404B92200G

241404B92200G

241404B92200G

Boyd Laconia, LLC

0 -
241404B92200G

数据表

- Bulk Active Top Mount Quarter Brick DC/DC Converter Rectangular, Fins 2.283" (58.00mm) 1.457" (37.00mm) - 0.449" (11.40mm) Bolt On - 1.00°C/W @ 500 LFM 2.50°C/W - -
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