| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 附件方式 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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574802B03300GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 0.900" (22.86mm) | 1.020" (25.91mm) | - | 0.420" (10.67mm) | Clip and PC Pin | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | Aluminum | Black Anodized |
|
EA-230-H145-T710STD,EA-230-H145-T710, CLIP ATTAC Boyd Laconia, LLC |
0 | - |
|
数据表 |
EA-230 | Bulk | Active | Top Mount | BGA, FPGA | Square, Pin Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | - | 0.571" (14.50mm) | Clip | - | 15.70°C/W @ 200 LFM | 44.20°C/W | Aluminum | Black Anodized |
|
533202B02551GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 2.003" (50.88mm) | 1.375" (34.93mm) | - | 0.500" (12.70mm) | Clip and PC Pin | 3.0W @ 30°C | 3.00°C/W @ 400 LFM | 9.00°C/W | Aluminum | Black Anodized |
|
EA-270-H125-T710STD,EA-270-H125-T710, CLIP ATTAC Boyd Laconia, LLC |
0 | - |
|
数据表 |
EA-270 | Bulk | Active | Top Mount | BGA, FPGA | Square, Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | - | 0.492" (12.50mm) | Clip | - | 15.80°C/W @ 200 LFM | 42.80°C/W | Aluminum | Black Anodized |
|
523002D00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | 0.500" (12.70mm) | Bolt On and PC Pin | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 13.60°C/W | - | Tin |
|
6230DG-CU6230DG-CU Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 1.000" (25.40mm) | 0.500" (12.70mm) | - | 1.180" (29.97mm) | Bolt On and PC Pin | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 12.50°C/W | Copper | Tin |
|
EA-230-H195-T710STD,EA-230-H195-T710, CLIP ATTAC Boyd Laconia, LLC |
0 | - |
|
数据表 |
EA-230 | Bulk | Active | Top Mount | BGA, FPGA | Square, Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | - | 0.768" (19.50mm) | Clip | - | 12.20°C/W @ 200 LFM | 36.80°C/W | Aluminum | Black Anodized |
|
6239B-MTGBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 1.159" (29.44mm) | 1.005" (25.53mm) | - | 0.610" (15.49mm) | Clip and PC Pin | 2.0W @ 40°C | 6.00°C/W @ 600 LFM | 13.60°C/W | Aluminum | Black Anodized |
|
6380BTHM,17500B-1G REV H Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-218, TO-220 | Rectangular, Fins | 1.650" (41.91mm) | 1.000" (25.40mm) | - | 1.000" (25.40mm) | Bolt On and PC Pin | 2.0W @ 20°C | 3.5°C/W @ 200 LFM | 6.80°C/W | Aluminum | Black Anodized |
|
241404B92200G241404B92200G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Top Mount | Quarter Brick DC/DC Converter | Rectangular, Fins | 2.283" (58.00mm) | 1.457" (37.00mm) | - | 0.449" (11.40mm) | Bolt On | - | 1.00°C/W @ 500 LFM | 2.50°C/W | - | - |