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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
568115B00000

568115B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
568115B00000

数据表

- Bulk Active Top Mount TO-3 Rectangular, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.750" (19.05mm) Bolt On 5.0W @ 40°C 1.50°C/W @ 200 LFM 6.70°C/W Aluminum Black Anodized
592502B02800G

592502B02800G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
592502B02800G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) Bolt On and Board Locks 1.5W @ 40°C 10.00°C/W @ 200 LFM 22.00°C/W Aluminum Black Anodized
529901B02100G

529901B02100G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
529901B02100G

数据表

- Bulk Active Board Level, Vertical TO-218 Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) Bolt On and PC Pin 12.0W @ 50°C 1.00°C/W @ 800 LFM 4.50°C/W Aluminum Black Anodized
568300B00000

568300B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
568300B00000

数据表

- Bulk Active - - - - - - - - - - - - -
568403B00000

568403B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
568403B00000

数据表

- Bulk Active Top Mount TO-3 Rectangular, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 1.500" (38.10mm) Bolt On 5.0W @ 30°C 2.00°C/W @ 300 LFM 4.70°C/W Aluminum Black Anodized
581102B02100G

581102B02100G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
581102B02100G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.500" (38.10mm) 0.640" (16.26mm) - 0.640" (16.26mm) Bolt On and PC Pin 3.0W @ 50°C 5.00°C/W @ 200 LFM 16.80°C/W Aluminum Black Anodized
501706B00000G

501706B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
501706B00000G

数据表

- Bulk Active Board Level TO-66 Rhombus 1.550" (39.37mm) 1.040" (26.42mm) - 0.500" (12.70mm) Bolt On 2.0W @ 30°C 7.00°C/W @ 200 LFM 10.70°C/W Aluminum Black Anodized
374624B00035G

374624B00035G

HEATSINK BGA W/ADHESIVE TAPE

Boyd Laconia, LLC

0 -
374624B00035G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) Thermal Tape, Adhesive (Included) 1.5W @ 40°C 7.60°C/W @ 200 LFM 23.40°C/W Aluminum Black Anodized
574902B04300G

574902B04300G

HEATSINK TO-220 VERT MNT W/TAB

Boyd Laconia, LLC

0 -
574902B04300G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.375" (34.93mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip and PC Pin 2.5W @ 40°C 6.00°C/W @ 400 LFM 16.00°C/W Aluminum Black Anodized
EA-290-H095-T710

EA-290-H095-T710

STD,EA-290-H095-T710, CLIP ATTAC

Boyd Laconia, LLC

0 -
EA-290-H095-T710

数据表

EA-290 Bulk Active Top Mount BGA, FPGA Square, Fins 1.142" (29.00mm) 1.142" (29.00mm) - 0.374" (9.50mm) Clip - 19.40°C/W @ 200 LFM 48.20°C/W Aluminum Black Anodized
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