| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 附件方式 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
575903B00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | TO-3 | Rhombus | 1.630" (41.40mm) | 1.290" (32.77mm) | - | 1.250" (31.75mm) | Bolt On | 7.0W @ 70°C | 3.00°C/W @ 300 LFM | 9.80°C/W | Aluminum | Black Anodized |
|
6230B-TT W /000353 PAD6230B-TT W /000353 PAD Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
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7106D/TRGBOARD LEVEL HEATSINK .375" D2PAK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Tape & Reel (TR) | Active | Top Mount | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | Rectangular, Fins | 0.591" (15.00mm) | 1.020" (25.91mm) | - | 0.375" (9.52mm) | SMD Pad | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Copper | Tin |
|
552803B00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | TO-3 | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | - | 0.750" (19.05mm) | Bolt On | 2.0W @ 20°C | 2.50°C/W @ 400 LFM | - | Aluminum | Black Anodized |
|
6000DGHEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | Axial Lead Devices | Rectangular | 1.000" (25.40mm) | 0.250" (6.35mm) | - | 1.075" (27.31mm) | PC Pin | - | - | 15.00°C/W | Copper | Tin |
|
552844B00000BOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | TO-220 (Dual) | Square, Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | - | 0.720" (18.29mm) | Bolt On | 3.0W @ 30°C | 3.00°C/W @ 300 LFM | 8.70°C/W | Aluminum | Black Anodized |
|
578902B03200GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | TO-220 | Rectangular, Fins | 0.690" (17.53mm) | 0.860" (21.84mm) | - | 0.395" (10.03mm) | Clip and PC Pin | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | 21.60°C/W | Aluminum | Black Anodized |
|
PF527GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Top Mount | TO-3 | Rhombus | 1.606" (40.80mm) | 1.060" (26.92mm) | - | 0.984" (25.00mm) | Bolt On | 6.0W @ 30°C | 5.00°C/W @ 400 LFM | 7.40°C/W | Aluminum | Black Anodized |
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375124B60024GHEATSINK BGA W/O SOLDER ANCHORS Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | BGA | Square, Pin Fins | 1.575" (40.00mm) | 1.575" (40.01mm) | - | 0.984" (25.00mm) | Solder Anchor | 8.0W @ 80°C | 3.80°C/W @ 200 LFM | 10.30°C/W | Aluminum | Black Anodized |
|
|
534302B03553GHEATSINK TO-220 W/TAB-KOOLCLIP Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 2.000" (50.80mm) | 1.380" (35.05mm) | - | 0.480" (12.19mm) | Clip and PC Pin | 6.0W @ 60°C | 5.00°C/W @ 200 LFM | 10.40°C/W | Aluminum | Black Anodized |