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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
575903B00000G

575903B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
575903B00000G

数据表

- Bulk Active Board Level TO-3 Rhombus 1.630" (41.40mm) 1.290" (32.77mm) - 1.250" (31.75mm) Bolt On 7.0W @ 70°C 3.00°C/W @ 300 LFM 9.80°C/W Aluminum Black Anodized
6230B-TT W /000353 PAD

6230B-TT W /000353 PAD

6230B-TT W /000353 PAD

Boyd Laconia, LLC

0 -
6230B-TT W /000353 PAD

数据表

- Bulk Active - - - - - - - - - - - - -
7106D/TRG

7106D/TRG

BOARD LEVEL HEATSINK .375" D2PAK

Boyd Laconia, LLC

0 -
7106D/TRG

数据表

- Tape & Reel (TR) Active Top Mount TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 Rectangular, Fins 0.591" (15.00mm) 1.020" (25.91mm) - 0.375" (9.52mm) SMD Pad 2.0W @ 40°C 5.00°C/W @ 400 LFM - Copper Tin
552803B00000G

552803B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
552803B00000G

数据表

- Bulk Active Board Level TO-3 Square, Fins 1.780" (45.21mm) 1.780" (45.21mm) - 0.750" (19.05mm) Bolt On 2.0W @ 20°C 2.50°C/W @ 400 LFM - Aluminum Black Anodized
6000DG

6000DG

HEAT SINK

Boyd Laconia, LLC

0 -
6000DG

数据表

- Bulk Active Board Level, Vertical Axial Lead Devices Rectangular 1.000" (25.40mm) 0.250" (6.35mm) - 1.075" (27.31mm) PC Pin - - 15.00°C/W Copper Tin
552844B00000

552844B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
552844B00000

数据表

- Bulk Active Board Level TO-220 (Dual) Square, Fins 1.780" (45.21mm) 1.780" (45.21mm) - 0.720" (18.29mm) Bolt On 3.0W @ 30°C 3.00°C/W @ 300 LFM 8.70°C/W Aluminum Black Anodized
578902B03200G

578902B03200G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
578902B03200G

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 0.690" (17.53mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip and PC Pin 3.0W @ 60°C 12.00°C/W @ 200 LFM 21.60°C/W Aluminum Black Anodized
PF527G

PF527G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
PF527G

数据表

- Bulk Active Top Mount TO-3 Rhombus 1.606" (40.80mm) 1.060" (26.92mm) - 0.984" (25.00mm) Bolt On 6.0W @ 30°C 5.00°C/W @ 400 LFM 7.40°C/W Aluminum Black Anodized
375124B60024G

375124B60024G

HEATSINK BGA W/O SOLDER ANCHORS

Boyd Laconia, LLC

0 -
375124B60024G

数据表

- Bulk Active Board Level BGA Square, Pin Fins 1.575" (40.00mm) 1.575" (40.01mm) - 0.984" (25.00mm) Solder Anchor 8.0W @ 80°C 3.80°C/W @ 200 LFM 10.30°C/W Aluminum Black Anodized
534302B03553G

534302B03553G

HEATSINK TO-220 W/TAB-KOOLCLIP

Boyd Laconia, LLC

0 -
534302B03553G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 2.000" (50.80mm) 1.380" (35.05mm) - 0.480" (12.19mm) Clip and PC Pin 6.0W @ 60°C 5.00°C/W @ 200 LFM 10.40°C/W Aluminum Black Anodized
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