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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
TV265

TV265

PRESSED HEATSINK, TV265G, ZA4037

Boyd Laconia, LLC

0 -
TV265

数据表

- Bulk Active Board Level, Vertical TO-218, TO-220 Rectangular, Fins 1.181" (30.00mm) 0.500" (12.70mm) - 1.772" (45.00mm) Bolt On and PC Pin 1.0W @ 20°C 10.00°C/W @ 200 LFM 13.00°C/W Aluminum Black Anodized
PF435G

PF435G

THM,ZA5085 ISS 2 PF435G

Boyd Laconia, LLC

0 -
PF435G

数据表

- Bulk Active Board Level, Vertical TO-220, TO-262 Rectangular, Fins 0.768" (19.51mm) 0.500" (12.70mm) - 0.512" (13.00mm) Bolt On and PC Pin 2.5W @ 60°C 8.00°C/W @ 400 LFM 20.30°C/W Aluminum Black Anodized
322805B00000G

322805B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
322805B00000G

数据表

- Bulk Active Top Mount TO-5 Cylindrical - - 0.315" (8.00mm) ID, 0.875" (22.23mm) OD 0.531" (13.50mm) Press Fit 1.0W @ 50°C 30.00°C/W @ 200 LFM 40.00°C/W Aluminum Black Anodized
2333B

2333B

HEAT SINK

Boyd Laconia, LLC

0 -
2333B

数据表

- Bulk Active - - - - - - - - - - - - -
531002B02100G

531002B02100G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
531002B02100G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) Bolt On and PC Pin 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
574102B03300G

574102B03300G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
574102B03300G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip and PC Pin 1.5W @ 40°C 8.00°C/W @ 500 LFM 23.20°C/W Aluminum Black Anodized
519803B00000G

519803B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
519803B00000G

数据表

- Bulk Active Board Level TO-3 Rhombus 1.550" (39.37mm) 1.550" (39.37mm) - 1.750" (44.45mm) Bolt On 10.0W @ 50°C 2.00°C/W @ 400 LFM 4.50°C/W Aluminum Black Anodized
PF752BG

PF752BG

PRESSED HTSK-AL-PF752-B-(D) (MRP

Boyd Laconia, LLC

0 -
PF752BG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.866" (22.00mm) 0.433" (11.00mm) - 0.750" (19.05mm) PC Pin 3.0W @ 60°C 6.00°C/W @ 600 LFM - Aluminum Black Anodized
507002B05300G

507002B05300G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
507002B05300G

数据表

Hat Section 5070 Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.700" (17.78mm) 1.750" (44.45mm) - 0.375" (9.52mm) Bolt On and PC Pin 2.0W @ 40°C 5.00°C/W @ 500 LFM 15.60°C/W Aluminum Black Anodized
375124B00035G

375124B00035G

375124B00035G

Boyd Laconia, LLC

0 -
375124B00035G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.984" (25.00mm) Thermal Tape, Adhesive (Included) - 3.83°C/W @ 200 LFM 10.30°C/W Aluminum Black Anodized
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