| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 附件方式 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TV4GPRESSED HTSK-(TV4G ZA0779/7)-R Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-126 | Rectangular, Fins | 0.866" (22.00mm) | 0.749" (19.03mm) | - | 0.749" (19.03mm) | Bolt On and PC Pin | 1.5W @ 40°C | 12.00°C/W @ 300 LFM | 21.60°C/W | Aluminum | Black Anodized |
|
374824B00032G374824B00032G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Top Mount | BGA | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 30°C | 4.30°C/W @ 200 LFM | 12.00°C/W | Aluminum | Black Anodized |
|
341600F00000GHEATSINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
PF758GPRESSED HTSK, ZA4290-8, PF758G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 0.866" (22.00mm) | 0.433" (11.00mm) | - | 0.945" (24.00mm) | PC Pin | 2.0W @ 40°C | 10.00°C/W @ 500 LFM | 17.30°C/W | Aluminum | Tin |
|
576802B00000GW/ROHS576802B00000GW/ROHS+TAB 059099 Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | TO-220, TO-262 | Rectangular, Fins | 0.750" (19.05mm) | 0.500" (12.70mm) | - | 0.500" (12.70mm) | Clip | 1.5W @ 40°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Aluminum | Black Anodized |
|
10-L4LB-05G10-L4LB-05G Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level | BGA, FPGA | Rectangular, Pin Fins | 1.780" (45.21mm) | 1.630" (41.40mm) | - | 0.460" (11.68mm) | Push Pin | 2.5W @ 50°C | 5.00°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
530400B00100GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220, TO-218 | Square, Angled Fins | 1.750" (44.45mm) | 0.490" (12.44mm) | - | 1.750" (44.45mm) | Bolt On and Board Mounts | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | 6.30°C/W | Aluminum | Black Anodized |
|
533102B02551GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | - | 0.500" (12.70mm) | Clip and PC Pin | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | Aluminum | Black Anodized |
|
M46162B021000GM46162B021000G,REV B,00,04 Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
7137DGBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
0 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 0.848" (21.55mm) | 0.900" (22.86mm) | - | 0.375" (9.52mm) | Clip and PC Pin | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Copper | Tin |