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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
TV4G

TV4G

PRESSED HTSK-(TV4G ZA0779/7)-R

Boyd Laconia, LLC

0 -
TV4G

数据表

- Bulk Active Board Level, Vertical TO-126 Rectangular, Fins 0.866" (22.00mm) 0.749" (19.03mm) - 0.749" (19.03mm) Bolt On and PC Pin 1.5W @ 40°C 12.00°C/W @ 300 LFM 21.60°C/W Aluminum Black Anodized
374824B00032G

374824B00032G

374824B00032G

Boyd Laconia, LLC

0 -
374824B00032G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.984" (25.00mm) Thermal Tape, Adhesive (Included) 2.0W @ 30°C 4.30°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
341600F00000G

341600F00000G

HEATSINK

Boyd Laconia, LLC

0 -
341600F00000G

数据表

- Bulk Active - - - - - - - - - - - - -
PF758G

PF758G

PRESSED HTSK, ZA4290-8, PF758G

Boyd Laconia, LLC

0 -
PF758G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.866" (22.00mm) 0.433" (11.00mm) - 0.945" (24.00mm) PC Pin 2.0W @ 40°C 10.00°C/W @ 500 LFM 17.30°C/W Aluminum Tin
576802B00000GW/ROHS

576802B00000GW/ROHS

576802B00000GW/ROHS+TAB 059099

Boyd Laconia, LLC

0 -
576802B00000GW/ROHS

数据表

- Bulk Active Board Level TO-220, TO-262 Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) Clip 1.5W @ 40°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
10-L4LB-05G

10-L4LB-05G

10-L4LB-05G

Boyd Laconia, LLC

0 -
10-L4LB-05G

数据表

- Bulk Active Board Level BGA, FPGA Rectangular, Pin Fins 1.780" (45.21mm) 1.630" (41.40mm) - 0.460" (11.68mm) Push Pin 2.5W @ 50°C 5.00°C/W @ 200 LFM - Aluminum Black Anodized
530400B00100G

530400B00100G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
530400B00100G

数据表

- Bulk Active Board Level, Vertical TO-220, TO-218 Square, Angled Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) Bolt On and Board Mounts 4.0W @ 30°C 2.00°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
533102B02551G

533102B02551G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
533102B02551G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 1.500" (38.10mm) 1.375" (34.93mm) - 0.500" (12.70mm) Clip and PC Pin 8.0W @ 80°C 3.00°C/W @ 500 LFM 11.00°C/W Aluminum Black Anodized
M46162B021000G

M46162B021000G

M46162B021000G,REV B,00,04

Boyd Laconia, LLC

0 -
M46162B021000G

数据表

- Bulk Active - - - - - - - - - - - - -
7137DG

7137DG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
7137DG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.848" (21.55mm) 0.900" (22.86mm) - 0.375" (9.52mm) Clip and PC Pin 1.5W @ 50°C 10.00°C/W @ 200 LFM 20.80°C/W Copper Tin
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