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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
514-83-192M16-001148

514-83-192M16-001148

CONN SOCKET BGA 192POS GOLD

Preci-Dip

0 -
514-83-192M16-001148

数据表

514 Bulk Active BGA 192 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
712-13-264-41-001000

712-13-264-41-001000

SOCKET CARRIER DUAL INLINE 64POS

Mill-Max Manufacturing Corp.

0 -
712-13-264-41-001000

数据表

712 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
514-83-223-18-091117

514-83-223-18-091117

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
514-83-223-18-091117

数据表

514 Bulk Active PGA 223 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
111-43-964-61-001000

111-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-964-61-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-254-31-018000

714-43-254-31-018000

CONN IC DIP SOCKET 54POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-254-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 54 (2 x 27) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
116-43-432-61-007000

116-43-432-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-432-61-007000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-964-41-003000

126-41-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-964-41-003000

数据表

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-964-41-003000

126-91-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-964-41-003000

数据表

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
32-C212-21

32-C212-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C212-21

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
614-83-175-16-072112

614-83-175-16-072112

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
614-83-175-16-072112

数据表

614 Bulk Active PGA 175 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-1420-G-R

APH-1420-G-R

APH-1420-G-R

Samtec Inc.

0 -
APH-1420-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0520-G-R

APH-0520-G-R

APH-0520-G-R

Samtec Inc.

0 -
APH-0520-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1520-G-R

APH-1520-G-R

APH-1520-G-R

Samtec Inc.

0 -
APH-1520-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1120-G-R

APH-1120-G-R

APH-1120-G-R

Samtec Inc.

0 -
APH-1120-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0420-G-R

APH-0420-G-R

APH-0420-G-R

Samtec Inc.

0 -
APH-0420-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1320-G-R

APH-1320-G-R

APH-1320-G-R

Samtec Inc.

0 -
APH-1320-G-R

数据表

* - Active - - - - - - - - - - - - - - -
110-93-624-61-801000

110-93-624-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-624-61-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-13-044-08-031003

510-13-044-08-031003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-13-044-08-031003

数据表

510 Bulk Active PGA 44 (8 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
48-3551-11

48-3551-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
48-3551-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
48-3552-11

48-3552-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
48-3552-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
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