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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0728-G-H

APH-0728-G-H

APH-0728-G-H

Samtec Inc.

0 -
APH-0728-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0828-G-H

APH-0828-G-H

APH-0828-G-H

Samtec Inc.

0 -
APH-0828-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0328-G-H

APH-0328-G-H

APH-0328-G-H

Samtec Inc.

0 -
APH-0328-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1828-G-H

APH-1828-G-H

APH-1828-G-H

Samtec Inc.

0 -
APH-1828-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1128-G-H

APH-1128-G-H

APH-1128-G-H

Samtec Inc.

0 -
APH-1128-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1728-G-H

APH-1728-G-H

APH-1728-G-H

Samtec Inc.

0 -
APH-1728-G-H

数据表

* - Active - - - - - - - - - - - - - - -
110-13-632-61-801000

110-13-632-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-632-61-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-13-320-61-801000

110-13-320-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-320-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
612-43-964-41-004000

612-43-964-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-964-41-004000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-93-964-41-004000

612-93-964-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-964-41-004000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-91-097-11-041003

510-91-097-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-91-097-11-041003

数据表

510 Bulk Active PGA 97 (11 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-83-223-18-091135

546-83-223-18-091135

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
546-83-223-18-091135

数据表

546 Bulk Active PGA 223 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
546-83-223-18-091136

546-83-223-18-091136

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
546-83-223-18-091136

数据表

546 Bulk Active PGA 223 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
614-83-179-15-041112

614-83-179-15-041112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

0 -
614-83-179-15-041112

数据表

614 Bulk Active PGA 179 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
517-83-391-18-101111

517-83-391-18-101111

CONN SOCKET PGA 391POS GOLD

Preci-Dip

0 -
517-83-391-18-101111

数据表

517 Bulk Active PGA 391 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-43-642-61-006000

116-43-642-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-642-61-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-642-61-006000

116-93-642-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-642-61-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-652-61-001000

111-43-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-652-61-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-652-61-001000

111-93-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-652-61-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-43-636-10-002000

299-43-636-10-002000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
299-43-636-10-002000

数据表

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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