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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-43-648-61-007000

116-43-648-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-648-61-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-91-085-11-041003

510-91-085-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-91-085-11-041003

数据表

510 Bulk Active PGA 85 (11 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-648-61-003000

115-43-648-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-648-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-83-364-17-091111

517-83-364-17-091111

CONN SOCKET PGA 364POS GOLD

Preci-Dip

0 -
517-83-364-17-091111

数据表

517 Bulk Active PGA 364 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
122-11-952-41-001000

122-11-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-952-41-001000

数据表

122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
614-83-168-17-101112

614-83-168-17-101112

CONN SOCKET PGA 168POS GOLD

Preci-Dip

0 -
614-83-168-17-101112

数据表

614 Bulk Active PGA 168 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
40-C182-20

40-C182-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C182-20

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APH-0428-G-T

APH-0428-G-T

APH-0428-G-T

Samtec Inc.

0 -
APH-0428-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0528-G-T

APH-0528-G-T

APH-0528-G-T

Samtec Inc.

0 -
APH-0528-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0928-G-T

APH-0928-G-T

APH-0928-G-T

Samtec Inc.

0 -
APH-0928-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0628-G-T

APH-0628-G-T

APH-0628-G-T

Samtec Inc.

0 -
APH-0628-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1228-G-T

APH-1228-G-T

APH-1228-G-T

Samtec Inc.

0 -
APH-1228-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1628-G-T

APH-1628-G-T

APH-1628-G-T

Samtec Inc.

0 -
APH-1628-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0828-G-T

APH-0828-G-T

APH-0828-G-T

Samtec Inc.

0 -
APH-0828-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1728-G-T

APH-1728-G-T

APH-1728-G-T

Samtec Inc.

0 -
APH-1728-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0728-G-T

APH-0728-G-T

APH-0728-G-T

Samtec Inc.

0 -
APH-0728-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1328-G-T

APH-1328-G-T

APH-1328-G-T

Samtec Inc.

0 -
APH-1328-G-T

数据表

* - Active - - - - - - - - - - - - - - -
116-43-950-61-006000

116-43-950-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-950-61-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-318-61-801000

110-93-318-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-318-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-83-365-17-091111

517-83-365-17-091111

CONN SOCKET PGA 365POS GOLD

Preci-Dip

0 -
517-83-365-17-091111

数据表

517 Bulk Active PGA 365 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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