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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
48-6551-11

48-6551-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
48-6551-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
48-6552-11

48-6552-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
48-6552-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
48-6553-11

48-6553-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
48-6553-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
48-3554-11

48-3554-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
48-3554-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
116-43-642-61-001000

116-43-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-642-61-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
127-43-764-41-003000

127-43-764-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
127-43-764-41-003000

数据表

127 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Wire Wrap 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-83-179-18-111112

614-83-179-18-111112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

0 -
614-83-179-18-111112

数据表

614 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-83-179-18-112112

614-83-179-18-112112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

0 -
614-83-179-18-112112

数据表

614 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-87-225-17-061112

614-87-225-17-061112

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
614-87-225-17-061112

数据表

614 Bulk Active PGA 225 (17 x 17) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-43-952-61-001000

110-43-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-952-61-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
200-6325-NUN-8100

200-6325-NUN-8100

CAMLEVER-STANDARD

3M

0 -
200-6325-NUN-8100

数据表

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 625 (25 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 150°C Gold Polyethersulfone (PES) 30.0µin (0.76µm) Beryllium Copper
36-6556-31

36-6556-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-6556-31

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
36-6556-21

36-6556-21

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-6556-21

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
APH-0428-G-H

APH-0428-G-H

APH-0428-G-H

Samtec Inc.

0 -
APH-0428-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0928-G-H

APH-0928-G-H

APH-0928-G-H

Samtec Inc.

0 -
APH-0928-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1428-G-H

APH-1428-G-H

APH-1428-G-H

Samtec Inc.

0 -
APH-1428-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1528-G-H

APH-1528-G-H

APH-1528-G-H

Samtec Inc.

0 -
APH-1528-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1928-G-H

APH-1928-G-H

APH-1928-G-H

Samtec Inc.

0 -
APH-1928-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0628-G-H

APH-0628-G-H

APH-0628-G-H

Samtec Inc.

0 -
APH-0628-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1228-G-H

APH-1228-G-H

APH-1228-G-H

Samtec Inc.

0 -
APH-1228-G-H

数据表

* - Active - - - - - - - - - - - - - - -
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