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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0426-G-R

APH-0426-G-R

APH-0426-G-R

Samtec Inc.

0 -
APH-0426-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0526-G-R

APH-0526-G-R

APH-0526-G-R

Samtec Inc.

0 -
APH-0526-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0926-G-R

APH-0926-G-R

APH-0926-G-R

Samtec Inc.

0 -
APH-0926-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0626-G-R

APH-0626-G-R

APH-0626-G-R

Samtec Inc.

0 -
APH-0626-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1626-G-R

APH-1626-G-R

APH-1626-G-R

Samtec Inc.

0 -
APH-1626-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1126-G-R

APH-1126-G-R

APH-1126-G-R

Samtec Inc.

0 -
APH-1126-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0726-G-R

APH-0726-G-R

APH-0726-G-R

Samtec Inc.

0 -
APH-0726-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0826-G-R

APH-0826-G-R

APH-0826-G-R

Samtec Inc.

0 -
APH-0826-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1326-G-R

APH-1326-G-R

APH-1326-G-R

Samtec Inc.

0 -
APH-1326-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1826-G-R

APH-1826-G-R

APH-1826-G-R

Samtec Inc.

0 -
APH-1826-G-R

数据表

* - Active - - - - - - - - - - - - - - -
38-0511-11

38-0511-11

CONN SOCKET SIP 38POS GOLD

Aries Electronics

0 -
38-0511-11

数据表

511 Bulk Active SIP 38 (1 x 38) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
121-11-964-41-001000

121-11-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-964-41-001000

数据表

121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
APA-624-G-B

APA-624-G-B

ADAPTER PLUG

Samtec Inc.

0 -
APA-624-G-B

数据表

APA Bulk Active - 24 (2 x 12) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
APO-324-G-B

APO-324-G-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-324-G-B

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
84-PGM11010-41

84-PGM11010-41

CONN SOCKET PGA GOLD

Aries Electronics

0 -
84-PGM11010-41

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
115-43-650-61-003000

115-43-650-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-650-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-636-61-001000

116-43-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-636-61-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-636-61-001000

116-93-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-636-61-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-652-61-001000

115-43-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-652-61-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-91-088-12-052002

510-91-088-12-052002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-91-088-12-052002

数据表

510 Bulk Active PGA 88 (12 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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