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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0326-G-T

APH-0326-G-T

APH-0326-G-T

Samtec Inc.

0 -
APH-0326-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1626-G-T

APH-1626-G-T

APH-1626-G-T

Samtec Inc.

0 -
APH-1626-G-T

数据表

* - Active - - - - - - - - - - - - - - -
110-43-652-61-001000

110-43-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-652-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-11-950-41-001000

122-11-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-950-41-001000

数据表

122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
116-43-650-61-003000

116-43-650-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-650-61-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-650-61-003000

116-93-650-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-650-61-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-642-61-008000

116-43-642-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-642-61-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-43-656-61-005000

117-43-656-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-43-656-61-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-632-G-Q

APA-632-G-Q

ADAPTER PLUG

Samtec Inc.

0 -
APA-632-G-Q

数据表

APA Tube Active - 32 (2 x 16) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
517-83-369-18-091111

517-83-369-18-091111

CONN SOCKET PGA 369POS GOLD

Preci-Dip

0 -
517-83-369-18-091111

数据表

517 Bulk Active PGA 369 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-43-648-61-001000

115-43-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-648-61-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-322-61-801000

110-93-322-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-322-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-422-61-001000

116-43-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-422-61-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-322-61-001000

116-93-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-322-61-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-432-61-006000

116-43-432-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-432-61-006000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
514-87-279-19-081117

514-87-279-19-081117

CONN SOCKET PGA 279POS GOLD

Preci-Dip

0 -
514-87-279-19-081117

数据表

514 Bulk Active PGA 279 (19 x 19) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-648-ZWGG-3

ICA-648-ZWGG-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-ZWGG-3

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
APO-632-G-R

APO-632-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-632-G-R

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
110-13-432-61-001000

110-13-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-432-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-13-632-61-001000

110-13-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-632-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
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