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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
517-87-559-22-131111

517-87-559-22-131111

CONN SOCKET PGA 559POS GOLD

Preci-Dip

0 -
517-87-559-22-131111

数据表

517 Bulk Active PGA 559 (22 x 22) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APA-632-G-P

APA-632-G-P

ADAPTER PLUG

Samtec Inc.

0 -
APA-632-G-P

数据表

APA Tube Active - 32 (2 x 16) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
116-43-428-61-007000

116-43-428-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-428-61-007000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-328-61-007000

116-93-328-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-328-61-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-964-61-105000

110-93-964-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-964-61-105000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1820-G-H

APH-1820-G-H

APH-1820-G-H

Samtec Inc.

0 -
APH-1820-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0520-G-H

APH-0520-G-H

APH-0520-G-H

Samtec Inc.

0 -
APH-0520-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0220-G-H

APH-0220-G-H

APH-0220-G-H

Samtec Inc.

0 -
APH-0220-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0720-G-H

APH-0720-G-H

APH-0720-G-H

Samtec Inc.

0 -
APH-0720-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0320-G-H

APH-0320-G-H

APH-0320-G-H

Samtec Inc.

0 -
APH-0320-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1620-G-H

APH-1620-G-H

APH-1620-G-H

Samtec Inc.

0 -
APH-1620-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1220-G-H

APH-1220-G-H

APH-1220-G-H

Samtec Inc.

0 -
APH-1220-G-H

数据表

* - Active - - - - - - - - - - - - - - -
123-13-650-41-001000

123-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-650-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
510-41-084-10-031001

510-41-084-10-031001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-41-084-10-031001

数据表

510 Bulk Active PGA 84 (10 x 10) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
514-87-281-19-081117

514-87-281-19-081117

CONN SOCKET PGA 281POS GOLD

Preci-Dip

0 -
514-87-281-19-081117

数据表

514 Bulk Active PGA 281 (19 x 19) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
714-43-252-31-018000

714-43-252-31-018000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-252-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
36-6503-31

36-6503-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
110-41-964-61-001000

110-41-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-964-61-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-650-61-001000

115-93-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-650-61-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-652-61-003000

116-43-652-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-652-61-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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