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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0324-G-R

APH-0324-G-R

APH-0324-G-R

Samtec Inc.

0 -
APH-0324-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1324-G-R

APH-1324-G-R

APH-1324-G-R

Samtec Inc.

0 -
APH-1324-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0824-G-R

APH-0824-G-R

APH-0824-G-R

Samtec Inc.

0 -
APH-0824-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0224-G-R

APH-0224-G-R

APH-0224-G-R

Samtec Inc.

0 -
APH-0224-G-R

数据表

* - Active - - - - - - - - - - - - - - -
32-6571-11

32-6571-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-6571-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
32-6573-11

32-6573-11

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
32-6573-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
110-43-316-61-801000

110-43-316-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-316-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-316-61-801000

110-93-316-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-316-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
121-13-952-41-001000

121-13-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
121-13-952-41-001000

数据表

121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
111-43-642-61-001000

111-43-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-642-61-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-642-61-001000

111-93-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-642-61-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APO-318-G-T

APO-318-G-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-318-G-T

数据表

* - Active - - - - - - - - - - - - - - -
HLS-0316-T-12

HLS-0316-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0316-T-12

数据表

HLS Tube Active SIP 48 (3 x 16) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
612-43-964-41-003000

612-43-964-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-964-41-003000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-93-964-41-003000

612-93-964-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-964-41-003000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0426-G-T

APH-0426-G-T

APH-0426-G-T

Samtec Inc.

0 -
APH-0426-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1426-G-T

APH-1426-G-T

APH-1426-G-T

Samtec Inc.

0 -
APH-1426-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1526-G-T

APH-1526-G-T

APH-1526-G-T

Samtec Inc.

0 -
APH-1526-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0626-G-T

APH-0626-G-T

APH-0626-G-T

Samtec Inc.

0 -
APH-0626-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1326-G-T

APH-1326-G-T

APH-1326-G-T

Samtec Inc.

0 -
APH-1326-G-T

数据表

* - Active - - - - - - - - - - - - - - -
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