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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1626-G-H

APH-1626-G-H

APH-1626-G-H

Samtec Inc.

0 -
APH-1626-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1126-G-H

APH-1126-G-H

APH-1126-G-H

Samtec Inc.

0 -
APH-1126-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1726-G-H

APH-1726-G-H

APH-1726-G-H

Samtec Inc.

0 -
APH-1726-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0726-G-H

APH-0726-G-H

APH-0726-G-H

Samtec Inc.

0 -
APH-0726-G-H

数据表

* - Active - - - - - - - - - - - - - - -
517-87-545-17-000111

517-87-545-17-000111

CONN SOCKET PGA 545POS GOLD

Preci-Dip

0 -
517-87-545-17-000111

数据表

517 Bulk Active PGA 545 (17 x 17) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-93-952-61-001000

115-93-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-952-61-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-640-61-001000

111-43-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-640-61-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-640-61-001000

111-93-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-640-61-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-648-G-M

APA-648-G-M

ADAPTER PLUG

Samtec Inc.

0 -
APA-648-G-M

数据表

APA Tube Active - 48 (2 x 24) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
32-6570-11

32-6570-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-6570-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
24-4508-31

24-4508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-4508-31

数据表

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
123-13-648-41-001000

123-13-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-648-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-43-314-61-801000

110-43-314-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-314-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-13-652-41-001000

612-13-652-41-001000

SOCKET CARRIER SLDRTL .600 52POS

Mill-Max Manufacturing Corp.

0 -
612-13-652-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
416-93-264-41-001000

416-93-264-41-001000

SOCKET DUAL INLINE ELEVATD 64POS

Mill-Max Manufacturing Corp.

0 -
416-93-264-41-001000

数据表

416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) - - Closed Frame 0.100" (2.54mm) - - - - - - -
116-43-318-61-001000

116-43-318-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-318-61-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-318-61-001000

116-93-318-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-318-61-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
32-3570-11

32-3570-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-3570-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
32-3571-11

32-3571-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-3571-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
32-3572-11

32-3572-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
32-3572-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
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