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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0216-G-T

APH-0216-G-T

APH-0216-G-T

Samtec Inc.

0 -
APH-0216-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0816-G-T

APH-0816-G-T

APH-0816-G-T

Samtec Inc.

0 -
APH-0816-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1616-G-T

APH-1616-G-T

APH-1616-G-T

Samtec Inc.

0 -
APH-1616-G-T

数据表

* - Active - - - - - - - - - - - - - - -
110-44-420-61-001000

110-44-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-420-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-952-41-008000

116-41-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-952-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-952-41-008000

116-91-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-952-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-11-640-41-001000

612-11-640-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-640-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) - - Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
115-44-314-61-003000

115-44-314-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-314-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
550-10-121-13-061101

550-10-121-13-061101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-121-13-061101

数据表

550 Bulk Active PGA 121 (13 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
HLS-0315-G-12

HLS-0315-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0315-G-12

数据表

HLS Tube Active SIP 45 (3 x 15) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
514-87-223-18-091117

514-87-223-18-091117

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
514-87-223-18-091117

数据表

514 Bulk Active PGA 223 (18 x 18) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
36-0501-21

36-0501-21

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0 -
36-0501-21

数据表

501 Bulk Active SIP 36 (1 x 36) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
36-0501-31

36-0501-31

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0 -
36-0501-31

数据表

501 Bulk Active SIP 36 (1 x 36) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
117-43-316-61-005000

117-43-316-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-43-316-61-005000

数据表

117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0320-T-11

HLS-0320-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0320-T-11

数据表

HLS Tube Active SIP 60 (3 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
517-87-401-19-101111

517-87-401-19-101111

CONN SOCKET PGA 401POS GOLD

Preci-Dip

0 -
517-87-401-19-101111

数据表

517 Bulk Active PGA 401 (19 x 19) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-43-628-61-003000

115-43-628-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-628-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-628-61-003000

115-93-628-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-628-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-320-61-006000

116-43-320-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-320-61-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-952-41-001000

612-41-952-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-952-41-001000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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