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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-91-950-41-008000

116-91-950-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-950-41-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-320-61-105000

110-43-320-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-320-61-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-420-61-105000

110-43-420-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-420-61-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-652-61-001000

110-44-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-652-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-652-61-001000

110-99-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-652-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-952-31-012000

614-93-952-31-012000

SOCKET CARRIER LOWPRO .900 52POS

Mill-Max Manufacturing Corp.

0 -
614-93-952-31-012000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-952-31-012000

614-43-952-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-952-31-012000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-306-61-001000

111-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-306-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-306-61-001000

111-93-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-306-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-648-AGT

ICA-648-AGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-AGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
33-0508-21

33-0508-21

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
33-0508-21

数据表

508 Bulk Active SIP 33 (1 x 33) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
33-0508-31

33-0508-31

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
33-0508-31

数据表

508 Bulk Active SIP 33 (1 x 33) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
116-41-652-41-001000

116-41-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-652-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-652-41-001000

116-91-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-652-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
32-0511-11

32-0511-11

CONN SOCKET SIP 32POS GOLD

Aries Electronics

0 -
32-0511-11

数据表

511 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
110-43-210-61-001000

110-43-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-210-61-001000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-310-61-001000

111-43-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-310-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-310-61-001000

111-93-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-310-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1936-T-R

APH-1936-T-R

APH-1936-T-R

Samtec Inc.

0 -
APH-1936-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0836-T-R

APH-0836-T-R

APH-0836-T-R

Samtec Inc.

0 -
APH-0836-T-R

数据表

* - Active - - - - - - - - - - - - - - -
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