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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
115-93-428-61-001000

115-93-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-428-61-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-628-61-001000

115-93-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-628-61-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-44-316-61-003000

115-44-316-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-316-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-322-61-105000

110-43-322-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-322-61-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-422-61-105000

110-43-422-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-422-61-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-422-61-105000

110-93-422-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-422-61-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-432-61-001000

110-43-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-432-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-652-41-002000

126-41-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-652-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-652-41-002000

126-91-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-652-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
29-0511-11

29-0511-11

CONN SOCKET SIP 29POS GOLD

Aries Electronics

0 -
29-0511-11

数据表

511 Bulk Active SIP 29 (1 x 29) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
24-3570-11

24-3570-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-3570-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
24-6573-11

24-6573-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-6573-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
APH-1920-G-H

APH-1920-G-H

APH-1920-G-H

Samtec Inc.

0 -
APH-1920-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0920-G-H

APH-0920-G-H

APH-0920-G-H

Samtec Inc.

0 -
APH-0920-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1420-G-H

APH-1420-G-H

APH-1420-G-H

Samtec Inc.

0 -
APH-1420-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1020-G-H

APH-1020-G-H

APH-1020-G-H

Samtec Inc.

0 -
APH-1020-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1520-G-H

APH-1520-G-H

APH-1520-G-H

Samtec Inc.

0 -
APH-1520-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0620-G-H

APH-0620-G-H

APH-0620-G-H

Samtec Inc.

0 -
APH-0620-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1320-G-H

APH-1320-G-H

APH-1320-G-H

Samtec Inc.

0 -
APH-1320-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1720-G-H

APH-1720-G-H

APH-1720-G-H

Samtec Inc.

0 -
APH-1720-G-H

数据表

* - Active - - - - - - - - - - - - - - -
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