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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0636-T-R

APH-0636-T-R

APH-0636-T-R

Samtec Inc.

0 -
APH-0636-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1636-T-R

APH-1636-T-R

APH-1636-T-R

Samtec Inc.

0 -
APH-1636-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0336-T-R

APH-0336-T-R

APH-0336-T-R

Samtec Inc.

0 -
APH-0336-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0436-T-R

APH-0436-T-R

APH-0436-T-R

Samtec Inc.

0 -
APH-0436-T-R

数据表

* - Active - - - - - - - - - - - - - - -
126-41-650-41-002000

126-41-650-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-650-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-650-41-002000

126-91-650-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-650-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-952-31-002000

614-43-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-952-31-002000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-952-31-002000

614-93-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-93-952-31-002000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-93-101-13-061001

510-93-101-13-061001

PGA SOCK 101PIN 13X13 SOLDER TL

Mill-Max Manufacturing Corp.

0 -
510-93-101-13-061001

数据表

510 Tube Active PGA 101 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
APA-632-G-A

APA-632-G-A

ADAPTER PLUG

Samtec Inc.

0 -
APA-632-G-A

数据表

APA Bulk Active - 32 (2 x 16) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
APO-632-G-A

APO-632-G-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-632-G-A

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
614-93-952-31-007000

614-93-952-31-007000

SOCKET CARRIER LOWPRO .900 52POS

Mill-Max Manufacturing Corp.

0 -
614-93-952-31-007000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-952-31-007000

614-43-952-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-952-31-007000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-652-41-008000

116-93-652-41-008000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-652-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-652-41-008000

116-43-652-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-652-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-44-306-61-003000

115-44-306-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-306-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-44-640-61-003000

115-44-640-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-640-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
39-0501-21

39-0501-21

CONN SOCKET SIP 39POS GOLD

Aries Electronics

0 -
39-0501-21

数据表

501 Bulk Active SIP 39 (1 x 39) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
39-0501-31

39-0501-31

CONN SOCKET SIP 39POS GOLD

Aries Electronics

0 -
39-0501-31

数据表

501 Bulk Active SIP 39 (1 x 39) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
612-41-652-41-001000

612-41-652-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-652-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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