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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1620-G-T

APH-1620-G-T

APH-1620-G-T

Samtec Inc.

0 -
APH-1620-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0720-G-T

APH-0720-G-T

APH-0720-G-T

Samtec Inc.

0 -
APH-0720-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0420-G-T

APH-0420-G-T

APH-0420-G-T

Samtec Inc.

0 -
APH-0420-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0820-G-T

APH-0820-G-T

APH-0820-G-T

Samtec Inc.

0 -
APH-0820-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1320-G-T

APH-1320-G-T

APH-1320-G-T

Samtec Inc.

0 -
APH-1320-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1220-G-T

APH-1220-G-T

APH-1220-G-T

Samtec Inc.

0 -
APH-1220-G-T

数据表

* - Active - - - - - - - - - - - - - - -
126-41-950-41-001000

126-41-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-950-41-001000

数据表

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-950-41-001000

126-91-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-950-41-001000

数据表

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
48-6820-90C

48-6820-90C

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
48-6822-90C

48-6822-90C

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
48-6823-90C

48-6823-90C

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
510-83-361-19-000101

510-83-361-19-000101

CONN SOCKET PGA 361POS GOLD

Preci-Dip

0 -
510-83-361-19-000101

数据表

510 Bulk Active PGA 361 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
2-822114-4

2-822114-4

CONN SOCKET PQFP 160POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
2-822114-4

数据表

- Tube Obsolete QFP 160 (4 x 40) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin-Lead Liquid Crystal Polymer (LCP) 200.0µin (5.08µm) Phosphor Bronze
122-11-640-41-001000

122-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-640-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
1051420133

1051420133

CONN SOCKET LGA 2011POS GOLD

Molex

0 -
1051420133

数据表

105142 Tray Obsolete LGA 2011 (47 x 58) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame 0.040" (1.02mm) Solder 0.040" (1.01mm) - - Thermoplastic - -
115-44-636-61-003000

115-44-636-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-636-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-650-61-001000

110-44-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-650-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-43-636-41-004000

612-43-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-636-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-93-636-41-004000

612-93-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-636-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
40-6621-30

40-6621-30

CONN IC DIP SOCKET 40POS TIN

Aries Electronics

0 -
40-6621-30

数据表

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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