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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
115-93-422-61-001000

115-93-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-422-61-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-83-133-14-071112

614-83-133-14-071112

CONN SOCKET PGA 133POS GOLD

Preci-Dip

0 -
614-83-133-14-071112

数据表

614 Bulk Active PGA 133 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
122-13-624-41-801000

122-13-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-624-41-801000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
614-43-652-31-002000

614-43-652-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-652-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-652-31-002000

614-93-652-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-93-652-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-0511-11

28-0511-11

CONN SOCKET SIP 28POS GOLD

Aries Electronics

0 -
28-0511-11

数据表

511 Bulk Active SIP 28 (1 x 28) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
32-C182-20

32-C182-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C182-20

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
32-C182-30

32-C182-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C182-30

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
32-C212-20

32-C212-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C212-20

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
32-C212-30

32-C212-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C212-30

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
32-C300-20

32-C300-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C300-20

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
32-C300-30

32-C300-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-C300-30

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
614-93-652-31-007000

614-93-652-31-007000

SOCKET CARRIER LOWPRO .600 52POS

Mill-Max Manufacturing Corp.

0 -
614-93-652-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-652-31-007000

614-43-652-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-652-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0320-T-12

HLS-0320-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0320-T-12

数据表

HLS Tube Active SIP 60 (3 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
APH-0920-G-T

APH-0920-G-T

APH-0920-G-T

Samtec Inc.

0 -
APH-0920-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0520-G-T

APH-0520-G-T

APH-0520-G-T

Samtec Inc.

0 -
APH-0520-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1020-G-T

APH-1020-G-T

APH-1020-G-T

Samtec Inc.

0 -
APH-1020-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1120-G-T

APH-1120-G-T

APH-1120-G-T

Samtec Inc.

0 -
APH-1120-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0220-G-T

APH-0220-G-T

APH-0220-G-T

Samtec Inc.

0 -
APH-0220-G-T

数据表

* - Active - - - - - - - - - - - - - - -
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