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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
27-0511-11

27-0511-11

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
27-0511-11

数据表

511 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
517-83-293-18-101111

517-83-293-18-101111

CONN SOCKET PGA 293POS GOLD

Preci-Dip

0 -
517-83-293-18-101111

数据表

517 Bulk Active PGA 293 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-47-652-41-001000

116-47-652-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-652-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-13-432-41-001000

122-13-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-432-41-001000

数据表

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
122-13-632-41-001000

122-13-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-632-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
115-44-632-61-003000

115-44-632-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-632-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0220-G-30

HLS-0220-G-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0220-G-30

数据表

HLS Tube Active SIP 40 (2 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
116-93-642-41-001000

116-93-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-642-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-642-41-001000

116-43-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-642-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-650-31-002000

614-43-650-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-650-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-650-31-002000

614-93-650-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-93-650-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-93-640-41-002000

126-93-640-41-002000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-640-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-640-41-002000

126-43-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-640-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
156-PGM16012-10

156-PGM16012-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
156-PGM16012-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
614-93-650-31-007000

614-93-650-31-007000

SOCKET CARRIER LOWPRO .600 50POS

Mill-Max Manufacturing Corp.

0 -
614-93-650-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-650-31-007000

614-43-650-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-650-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-44-424-61-003000

115-44-424-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-424-61-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-432-61-001000

110-91-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-432-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-318-61-605000

110-43-318-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-318-61-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-91-114-13-062001

510-91-114-13-062001

SOCKET SOLDERTAIL 114-PGA

Mill-Max Manufacturing Corp.

0 -
510-91-114-13-062001

数据表

510 Tube Active PGA 114 (13 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
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