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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
614-41-952-31-018000

614-41-952-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-952-31-018000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-952-31-018000

614-91-952-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-952-31-018000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-314-61-001000

111-93-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-314-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-642-41-004000

612-41-642-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-642-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-642-41-004000

612-91-642-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-642-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0914-G-R

APH-0914-G-R

APH-0914-G-R

Samtec Inc.

0 -
APH-0914-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1414-G-R

APH-1414-G-R

APH-1414-G-R

Samtec Inc.

0 -
APH-1414-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1914-G-R

APH-1914-G-R

APH-1914-G-R

Samtec Inc.

0 -
APH-1914-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1014-G-R

APH-1014-G-R

APH-1014-G-R

Samtec Inc.

0 -
APH-1014-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0614-G-R

APH-0614-G-R

APH-0614-G-R

Samtec Inc.

0 -
APH-0614-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1114-G-R

APH-1114-G-R

APH-1114-G-R

Samtec Inc.

0 -
APH-1114-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0214-G-R

APH-0214-G-R

APH-0214-G-R

Samtec Inc.

0 -
APH-0214-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0414-G-R

APH-0414-G-R

APH-0414-G-R

Samtec Inc.

0 -
APH-0414-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1314-G-R

APH-1314-G-R

APH-1314-G-R

Samtec Inc.

0 -
APH-1314-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1214-G-R

APH-1214-G-R

APH-1214-G-R

Samtec Inc.

0 -
APH-1214-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0314-G-R

APH-0314-G-R

APH-0314-G-R

Samtec Inc.

0 -
APH-0314-G-R

数据表

* - Active - - - - - - - - - - - - - - -
84-PGM13042-50

84-PGM13042-50

CONN SOCKET PGA GOLD

Aries Electronics

0 -
84-PGM13042-50

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
84-PGM13053-50

84-PGM13053-50

CONN SOCKET PGA GOLD

Aries Electronics

0 -
84-PGM13053-50

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
123-13-318-41-801000

123-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-318-41-801000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
84-PGM11010-11H

84-PGM11010-11H

CONN SOCKET PGA GOLD

Aries Electronics

0 -
84-PGM11010-11H

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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