富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
20-4508-31

20-4508-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4508-31

数据表

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
APO-324-G-R

APO-324-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-324-G-R

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
APO-624-G-R

APO-624-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-624-G-R

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
614-93-650-31-018000

614-93-650-31-018000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
614-93-650-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-650-31-018000

614-43-650-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-650-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
110-43-322-61-001000

110-43-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-322-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0936-T-H

APH-0936-T-H

APH-0936-T-H

Samtec Inc.

0 -
APH-0936-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0536-T-H

APH-0536-T-H

APH-0536-T-H

Samtec Inc.

0 -
APH-0536-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1936-T-H

APH-1936-T-H

APH-1936-T-H

Samtec Inc.

0 -
APH-1936-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1736-T-H

APH-1736-T-H

APH-1736-T-H

Samtec Inc.

0 -
APH-1736-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1636-T-H

APH-1636-T-H

APH-1636-T-H

Samtec Inc.

0 -
APH-1636-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0836-T-H

APH-0836-T-H

APH-0836-T-H

Samtec Inc.

0 -
APH-0836-T-H

数据表

* - Active - - - - - - - - - - - - - - -
550-10-192M16-001166

550-10-192M16-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
550-10-192M16-001166

数据表

550 Bulk Active BGA 192 (16 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
614-41-952-41-001000

614-41-952-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-952-41-001000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-952-41-001000

614-91-952-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-952-41-001000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
36-81250-610C

36-81250-610C

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-81250-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
36-8580-610C

36-8580-610C

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-8580-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
36-8750-310C

36-8750-310C

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-8750-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
104-11-652-41-780000

104-11-652-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-652-41-780000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
416-93-264-41-006000

416-93-264-41-006000

SOCKET DUAL INLINE ELEVATD 64POS

Mill-Max Manufacturing Corp.

0 -
416-93-264-41-006000

数据表

416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) - - Closed Frame 0.100" (2.54mm) - - - - - - -
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户