富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
714-43-238-31-018000

714-43-238-31-018000

CONN IC DIP SOCKET 38POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-238-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 38 (2 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
110-13-952-41-001000

110-13-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-13-952-41-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
115-43-320-61-003000

115-43-320-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-320-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-320-61-003000

115-93-320-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-320-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-328-61-001000

110-91-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-328-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-428-61-001000

110-91-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-428-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-648-41-008000

116-93-648-41-008000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-648-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-648-41-008000

116-43-648-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-648-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-648-41-001000

612-41-648-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-648-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-648-41-001000

612-91-648-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-648-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-318-61-001000

115-43-318-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-318-61-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-318-61-001000

115-93-318-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-318-61-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-964-41-001000

115-93-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-964-41-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-964-41-001000

115-43-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-964-41-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-648-CGG

ICO-648-CGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-648-CGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
712-13-132-41-001000

712-13-132-41-001000

SOCKET CARRIER SIP 32POS

Mill-Max Manufacturing Corp.

0 -
712-13-132-41-001000

数据表

712 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-44-636-61-001000

110-44-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-636-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-636-61-001000

110-99-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-636-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-308-61-008000

116-93-308-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-308-61-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-13-328-41-001000

123-13-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-328-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户