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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0534-T-R

APH-0534-T-R

APH-0534-T-R

Samtec Inc.

0 -
APH-0534-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1434-T-R

APH-1434-T-R

APH-1434-T-R

Samtec Inc.

0 -
APH-1434-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1034-T-R

APH-1034-T-R

APH-1034-T-R

Samtec Inc.

0 -
APH-1034-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1534-T-R

APH-1534-T-R

APH-1534-T-R

Samtec Inc.

0 -
APH-1534-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1134-T-R

APH-1134-T-R

APH-1134-T-R

Samtec Inc.

0 -
APH-1134-T-R

数据表

* - Active - - - - - - - - - - - - - - -
126-41-636-41-003000

126-41-636-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-636-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-636-41-003000

126-91-636-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-636-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
326-93-132-41-002000

326-93-132-41-002000

SOCKET WRAP SOLDERTAIL SIP 32POS

Mill-Max Manufacturing Corp.

0 -
326-93-132-41-002000

数据表

326 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-640-41-001000

116-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-640-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-640-41-001000

116-43-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-640-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-952-31-002000

614-41-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-952-31-002000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-952-31-002000

614-91-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-952-31-002000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-87-419-19-111111

517-87-419-19-111111

CONN SOCKET PGA 419POS GOLD

Preci-Dip

0 -
517-87-419-19-111111

数据表

517 Bulk Active PGA 419 (19 x 19) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-41-952-31-007000

614-41-952-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-952-31-007000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-952-31-007000

614-91-952-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-952-31-007000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8080-1G9

8080-1G9

CONN TRANSIST TO-3 4POS GOLD

TE Connectivity AMP Connectors

0 -
8080-1G9

数据表

8080 Bulk Active Transistor, TO-3 4 (Round) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Gold Fluoropolymer (FP) - Beryllium Copper
1825088-4

1825088-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
1825088-4

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Thermoplastic - Brass
30-0511-11

30-0511-11

CONN SOCKET SIP 30POS GOLD

Aries Electronics

0 -
30-0511-11

数据表

511 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
550-10-114-13-062101

550-10-114-13-062101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-114-13-062101

数据表

550 Bulk Active PGA 114 (13 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
48-6556-20

48-6556-20

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6556-20

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
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