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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
546-83-145-15-081136

546-83-145-15-081136

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
546-83-145-15-081136

数据表

546 Bulk Active PGA 145 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
34-6621-30

34-6621-30

CONN IC DIP SOCKET 34POS TIN

Aries Electronics

0 -
34-6621-30

数据表

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
69-PGM11030-11

69-PGM11030-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
69-PGM11030-11

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
69-PGM11031-11

69-PGM11031-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
69-PGM11031-11

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
69-PGM11053-11

69-PGM11053-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
69-PGM11053-11

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
132-PGM14016-10

132-PGM14016-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
132-PGM14016-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
612-41-640-41-003000

612-41-640-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-640-41-003000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-640-41-003000

612-91-640-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-640-41-003000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-13-640-41-770000

104-13-640-41-770000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-640-41-770000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
116-41-650-41-008000

116-41-650-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-650-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-650-41-008000

116-91-650-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-650-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1818-G-T

APH-1818-G-T

APH-1818-G-T

Samtec Inc.

0 -
APH-1818-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1918-G-T

APH-1918-G-T

APH-1918-G-T

Samtec Inc.

0 -
APH-1918-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0618-G-T

APH-0618-G-T

APH-0618-G-T

Samtec Inc.

0 -
APH-0618-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1118-G-T

APH-1118-G-T

APH-1118-G-T

Samtec Inc.

0 -
APH-1118-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0218-G-T

APH-0218-G-T

APH-0218-G-T

Samtec Inc.

0 -
APH-0218-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1318-G-T

APH-1318-G-T

APH-1318-G-T

Samtec Inc.

0 -
APH-1318-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0718-G-T

APH-0718-G-T

APH-0718-G-T

Samtec Inc.

0 -
APH-0718-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1618-G-T

APH-1618-G-T

APH-1618-G-T

Samtec Inc.

0 -
APH-1618-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0818-G-T

APH-0818-G-T

APH-0818-G-T

Samtec Inc.

0 -
APH-0818-G-T

数据表

* - Active - - - - - - - - - - - - - - -
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