富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0230-T-R

APH-0230-T-R

APH-0230-T-R

Samtec Inc.

0 -
APH-0230-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1734-T-T

APH-1734-T-T

APH-1734-T-T

Samtec Inc.

0 -
APH-1734-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0234-T-T

APH-0234-T-T

APH-0234-T-T

Samtec Inc.

0 -
APH-0234-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0834-T-T

APH-0834-T-T

APH-0834-T-T

Samtec Inc.

0 -
APH-0834-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1334-T-T

APH-1334-T-T

APH-1334-T-T

Samtec Inc.

0 -
APH-1334-T-T

数据表

* - Active - - - - - - - - - - - - - - -
545092-4

545092-4

CONN SOCKET PGA 48POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
545092-4

数据表

- Tube Obsolete PGA 48 (4 x 12) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin-Lead Polybutylene Terephthalate (PBT) 100.0µin (2.54µm) Brass
HLS-0313-G-11

HLS-0313-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0313-G-11

数据表

HLS Tube Active SIP 39 (3 x 13) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
126-41-432-41-003000

126-41-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-432-41-003000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-632-41-003000

126-41-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-632-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-432-41-003000

126-91-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-432-41-003000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-632-41-003000

126-91-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-632-41-003000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
68-PGM11032-11

68-PGM11032-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
68-PGM11032-11

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
68-PGM11033-11

68-PGM11033-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
68-PGM11033-11

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
546-83-144-13-041135

546-83-144-13-041135

CONN SOCKET PGA 144POS GOLD

Preci-Dip

0 -
546-83-144-13-041135

数据表

546 Bulk Active PGA 144 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
546-83-144-13-041136

546-83-144-13-041136

CONN SOCKET PGA 144POS GOLD

Preci-Dip

0 -
546-83-144-13-041136

数据表

546 Bulk Active PGA 144 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
605-41-648-11-480000

605-41-648-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-41-648-11-480000

数据表

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-91-648-11-480000

605-91-648-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-91-648-11-480000

数据表

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-642-31-002000

614-43-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-642-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-642-31-002000

614-93-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-93-642-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-310-61-001000

115-43-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-310-61-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户