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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
HLS-0220-G-38

HLS-0220-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0220-G-38

数据表

HLS Tube Active SIP 40 (2 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
48-6503-20

48-6503-20

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6503-20

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
612-43-432-41-003000

612-43-432-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-432-41-003000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-43-632-41-003000

612-43-632-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-632-41-003000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-93-432-41-003000

612-93-432-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-432-41-003000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-93-632-41-003000

612-93-632-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-632-41-003000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-87-391-18-101111

517-87-391-18-101111

CONN SOCKET PGA 391POS GOLD

Preci-Dip

0 -
517-87-391-18-101111

数据表

517 Bulk Active PGA 391 (18 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
126-41-636-41-002000

126-41-636-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-636-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-636-41-002000

126-91-636-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-636-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
514-83-145-15-081117

514-83-145-15-081117

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
514-83-145-15-081117

数据表

514 Bulk Active PGA 145 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-93-642-31-012000

614-93-642-31-012000

SOCKET CARRIER LOWPRO .600 42POS

Mill-Max Manufacturing Corp.

0 -
614-93-642-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-642-31-012000

614-43-642-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-642-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1830-T-R

APH-1830-T-R

APH-1830-T-R

Samtec Inc.

0 -
APH-1830-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1834-T-T

APH-1834-T-T

APH-1834-T-T

Samtec Inc.

0 -
APH-1834-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1034-T-T

APH-1034-T-T

APH-1034-T-T

Samtec Inc.

0 -
APH-1034-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1930-T-R

APH-1930-T-R

APH-1930-T-R

Samtec Inc.

0 -
APH-1930-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1534-T-T

APH-1534-T-T

APH-1534-T-T

Samtec Inc.

0 -
APH-1534-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0734-T-T

APH-0734-T-T

APH-0734-T-T

Samtec Inc.

0 -
APH-0734-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1234-T-T

APH-1234-T-T

APH-1234-T-T

Samtec Inc.

0 -
APH-1234-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1634-T-T

APH-1634-T-T

APH-1634-T-T

Samtec Inc.

0 -
APH-1634-T-T

数据表

* - Active - - - - - - - - - - - - - - -
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