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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1218-G-T

APH-1218-G-T

APH-1218-G-T

Samtec Inc.

0 -
APH-1218-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0318-G-T

APH-0318-G-T

APH-0318-G-T

Samtec Inc.

0 -
APH-0318-G-T

数据表

* - Active - - - - - - - - - - - - - - -
133-PGM13046-10

133-PGM13046-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
133-PGM13046-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
133-PGM14013-10

133-PGM14013-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
133-PGM14013-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
160-PGM15056-10

160-PGM15056-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
160-PGM15056-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
614-83-121-13-061112

614-83-121-13-061112

CONN SOCKET PGA 121POS GOLD

Preci-Dip

0 -
614-83-121-13-061112

数据表

614 Bulk Active PGA 121 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-41-642-41-001000

116-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-642-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-642-41-001000

116-91-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-642-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
316-93-132-41-001000

316-93-132-41-001000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

0 -
316-93-132-41-001000

数据表

316 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-163-31-018000

714-43-163-31-018000

CONN SOCKET SIP 63POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-163-31-018000

数据表

714 Bulk Active SIP 63 (1 x 63) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
48-6556-30

48-6556-30

UNIVERSAL TEST SOCKET 48POS

Aries Electronics

0 -
48-6556-30

数据表

6556 - Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
48-3551-10

48-3551-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

0 -
48-3551-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
60-9513-11H

60-9513-11H

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0 -
60-9513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
APH-0432-T-R

APH-0432-T-R

APH-0432-T-R

Samtec Inc.

0 -
APH-0432-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1832-T-R

APH-1832-T-R

APH-1832-T-R

Samtec Inc.

0 -
APH-1832-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0932-T-R

APH-0932-T-R

APH-0932-T-R

Samtec Inc.

0 -
APH-0932-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1032-T-R

APH-1032-T-R

APH-1032-T-R

Samtec Inc.

0 -
APH-1032-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1932-T-R

APH-1932-T-R

APH-1932-T-R

Samtec Inc.

0 -
APH-1932-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0632-T-R

APH-0632-T-R

APH-0632-T-R

Samtec Inc.

0 -
APH-0632-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1632-T-R

APH-1632-T-R

APH-1632-T-R

Samtec Inc.

0 -
APH-1632-T-R

数据表

* - Active - - - - - - - - - - - - - - -
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