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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
115-43-950-41-001000

115-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-950-41-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-13-424-41-001000

123-13-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-424-41-001000

数据表

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
124-41-432-41-002000

124-41-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-41-432-41-002000

数据表

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-41-632-41-002000

124-41-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-41-632-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-91-432-41-002000

124-91-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-91-432-41-002000

数据表

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-91-632-41-002000

124-91-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-91-632-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1832-T-T

APH-1832-T-T

APH-1832-T-T

Samtec Inc.

0 -
APH-1832-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0532-T-T

APH-0532-T-T

APH-0532-T-T

Samtec Inc.

0 -
APH-0532-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0932-T-T

APH-0932-T-T

APH-0932-T-T

Samtec Inc.

0 -
APH-0932-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0632-T-T

APH-0632-T-T

APH-0632-T-T

Samtec Inc.

0 -
APH-0632-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0332-T-T

APH-0332-T-T

APH-0332-T-T

Samtec Inc.

0 -
APH-0332-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0832-T-T

APH-0832-T-T

APH-0832-T-T

Samtec Inc.

0 -
APH-0832-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0232-T-T

APH-0232-T-T

APH-0232-T-T

Samtec Inc.

0 -
APH-0232-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0732-T-T

APH-0732-T-T

APH-0732-T-T

Samtec Inc.

0 -
APH-0732-T-T

数据表

* - Active - - - - - - - - - - - - - - -
25-0508-21

25-0508-21

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0508-21

数据表

508 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
40-6820-90C

40-6820-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
614-93-640-31-018000

614-93-640-31-018000

SOCKET CARRIER LOWPRO .600 40POS

Mill-Max Manufacturing Corp.

0 -
614-93-640-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-640-31-018000

614-43-640-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-640-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
40-6508-201

40-6508-201

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6508-201

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
40-6508-202

40-6508-202

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6508-202

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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