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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1540-T-R

APH-1540-T-R

APH-1540-T-R

Samtec Inc.

0 -
APH-1540-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1040-T-R

APH-1040-T-R

APH-1040-T-R

Samtec Inc.

0 -
APH-1040-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1740-T-R

APH-1740-T-R

APH-1740-T-R

Samtec Inc.

0 -
APH-1740-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1240-T-R

APH-1240-T-R

APH-1240-T-R

Samtec Inc.

0 -
APH-1240-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0340-T-R

APH-0340-T-R

APH-0340-T-R

Samtec Inc.

0 -
APH-0340-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0240-T-R

APH-0240-T-R

APH-0240-T-R

Samtec Inc.

0 -
APH-0240-T-R

数据表

* - Active - - - - - - - - - - - - - - -
415-93-264-41-001000

415-93-264-41-001000

SOCKET DUAL INLINE LOW PRO 64POS

Mill-Max Manufacturing Corp.

0 -
415-93-264-41-001000

数据表

415 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
56-1508-20

56-1508-20

CONN IC DIP SOCKET 56POS GOLD

Aries Electronics

0 -
56-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 56 (2 x 28) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
116-47-964-41-006000

116-47-964-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-964-41-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-11-642-41-780000

104-11-642-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-642-41-780000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
APA-320-G-P

APA-320-G-P

ADAPTER PLUG

Samtec Inc.

0 -
APA-320-G-P

数据表

APA Bag Active - 20 (2 x 10) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
110-93-632-41-801000

110-93-632-41-801000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-632-41-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-632-41-801000

110-43-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-632-41-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
37-0501-20

37-0501-20

CONN SOCKET SIP 37POS TIN

Aries Electronics

0 -
37-0501-20

数据表

501 Bulk Active SIP 37 (1 x 37) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
37-0501-30

37-0501-30

CONN SOCKET SIP 37POS TIN

Aries Electronics

0 -
37-0501-30

数据表

501 Bulk Active SIP 37 (1 x 37) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
116-41-648-41-008000

116-41-648-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-648-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-648-41-008000

116-91-648-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-648-41-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-306-61-001000

115-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-306-61-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-306-61-001000

115-93-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-306-61-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-950-41-001000

115-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-950-41-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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