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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
34-6501-31

34-6501-31

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-6501-31

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
17-0511-11

17-0511-11

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0511-11

数据表

511 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
40-0501-20

40-0501-20

CONN SOCKET SIP 40POS TIN

Aries Electronics

0 -
40-0501-20

数据表

501 Bulk Active SIP 40 (1 x 40) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
40-0501-30

40-0501-30

CONN SOCKET SIP 40POS TIN

Aries Electronics

0 -
40-0501-30

数据表

501 Bulk Active SIP 40 (1 x 40) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
APH-1910-G-H

APH-1910-G-H

APH-1910-G-H

Samtec Inc.

0 -
APH-1910-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0610-G-H

APH-0610-G-H

APH-0610-G-H

Samtec Inc.

0 -
APH-0610-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0210-G-H

APH-0210-G-H

APH-0210-G-H

Samtec Inc.

0 -
APH-0210-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0310-G-H

APH-0310-G-H

APH-0310-G-H

Samtec Inc.

0 -
APH-0310-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0710-G-H

APH-0710-G-H

APH-0710-G-H

Samtec Inc.

0 -
APH-0710-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1610-G-H

APH-1610-G-H

APH-1610-G-H

Samtec Inc.

0 -
APH-1610-G-H

数据表

* - Active - - - - - - - - - - - - - - -
126-93-316-41-002000

126-93-316-41-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-316-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-316-41-002000

126-43-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-316-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-13-314-41-001000

122-13-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-314-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
18-0511-11

18-0511-11

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0511-11

数据表

511 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
614-93-424-31-012000

614-93-424-31-012000

SOCKET CARRIER LOWPRO .400 24POS

Mill-Max Manufacturing Corp.

0 -
614-93-424-31-012000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-424-31-012000

614-43-424-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-424-31-012000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-149-31-018000

714-43-149-31-018000

CONN SOCKET SIP 49POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-149-31-018000

数据表

714 Bulk Active SIP 49 (1 x 49) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
110-93-640-41-605000

110-93-640-41-605000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-640-41-605000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-640-41-605000

110-43-640-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-640-41-605000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0532-T-R

APH-0532-T-R

APH-0532-T-R

Samtec Inc.

0 -
APH-0532-T-R

数据表

* - Active - - - - - - - - - - - - - - -
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