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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1014-G-T

APH-1014-G-T

APH-1014-G-T

Samtec Inc.

0 -
APH-1014-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1114-G-T

APH-1114-G-T

APH-1114-G-T

Samtec Inc.

0 -
APH-1114-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0214-G-T

APH-0214-G-T

APH-0214-G-T

Samtec Inc.

0 -
APH-0214-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1214-G-T

APH-1214-G-T

APH-1214-G-T

Samtec Inc.

0 -
APH-1214-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1714-G-T

APH-1714-G-T

APH-1714-G-T

Samtec Inc.

0 -
APH-1714-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1314-G-T

APH-1314-G-T

APH-1314-G-T

Samtec Inc.

0 -
APH-1314-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0814-G-T

APH-0814-G-T

APH-0814-G-T

Samtec Inc.

0 -
APH-0814-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0314-G-T

APH-0314-G-T

APH-0314-G-T

Samtec Inc.

0 -
APH-0314-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0714-G-T

APH-0714-G-T

APH-0714-G-T

Samtec Inc.

0 -
APH-0714-G-T

数据表

* - Active - - - - - - - - - - - - - - -
110-43-328-10-002000

110-43-328-10-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-43-328-10-002000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14), 14 Loaded Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-316-41-003000

126-41-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-316-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-316-41-003000

126-91-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-316-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-636-41-006000

116-41-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-636-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-636-41-006000

116-91-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-636-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-87-145-15-081136

546-87-145-15-081136

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
546-87-145-15-081136

数据表

546 Bulk Active PGA 145 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
146-93-628-41-012000

146-93-628-41-012000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
146-93-628-41-012000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-43-628-41-012000

146-43-628-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-43-628-41-012000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APO-422-G-A

APO-422-G-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-G-A

数据表

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
32-8800-610C

32-8800-610C

CONN ELEVATOR SOCKET 32 PIN .600

Aries Electronics

0 -
32-8800-610C

数据表

8 - Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
34-6501-21

34-6501-21

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-6501-21

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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