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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1532-T-R

APH-1532-T-R

APH-1532-T-R

Samtec Inc.

0 -
APH-1532-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0232-T-R

APH-0232-T-R

APH-0232-T-R

Samtec Inc.

0 -
APH-0232-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1332-T-R

APH-1332-T-R

APH-1332-T-R

Samtec Inc.

0 -
APH-1332-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0832-T-R

APH-0832-T-R

APH-0832-T-R

Samtec Inc.

0 -
APH-0832-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0332-T-R

APH-0332-T-R

APH-0332-T-R

Samtec Inc.

0 -
APH-0332-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0732-T-R

APH-0732-T-R

APH-0732-T-R

Samtec Inc.

0 -
APH-0732-T-R

数据表

* - Active - - - - - - - - - - - - - - -
110-91-952-41-001000

110-91-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-91-952-41-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-41-952-41-001000

110-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-952-41-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-11-314-41-001000

123-11-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-314-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
614-43-324-31-002000

614-43-324-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-324-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-424-31-002000

614-43-424-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-424-31-002000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-624-31-002000

614-43-624-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-624-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-324-31-002000

614-93-324-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-93-324-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-424-31-002000

614-93-424-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-93-424-31-002000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-624-31-002000

614-93-624-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-93-624-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-93-163-41-013000

346-93-163-41-013000

CONN SOCKET SIP 63POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-163-41-013000

数据表

346 Bulk Active SIP 63 (1 x 63) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-163-41-013000

346-43-163-41-013000

CONN SOCKET SIP 63POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-163-41-013000

数据表

346 Bulk Active SIP 63 (1 x 63) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0807-T-2

HLS-0807-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0807-T-2

数据表

HLS Bulk Active SIP 56 (8 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
116-93-320-41-001000

116-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-320-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-420-41-001000

116-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-420-41-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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