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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
605-93-324-11-480000

605-93-324-11-480000

SOCKET CARRIER LOWPRO .300 24POS

Mill-Max Manufacturing Corp.

0 -
605-93-324-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-93-424-11-480000

605-93-424-11-480000

SOCKET CARRIER LOWPRO .400 24POS

Mill-Max Manufacturing Corp.

0 -
605-93-424-11-480000

数据表

605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-93-624-11-480000

605-93-624-11-480000

SOCKET CARRIER LOWPRO .600 24POS

Mill-Max Manufacturing Corp.

0 -
605-93-624-11-480000

数据表

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-43-324-11-480000

605-43-324-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-43-324-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-43-424-11-480000

605-43-424-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-43-424-11-480000

数据表

605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-43-624-11-480000

605-43-624-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-43-624-11-480000

数据表

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-41-632-41-013000

146-41-632-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-41-632-41-013000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-91-632-41-013000

146-91-632-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-91-632-41-013000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-432-41-007000

116-47-432-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-432-41-007000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-632-41-007000

116-47-632-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-632-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
TMJ03DKSD-S1512

TMJ03DKSD-S1512

CONN TRANSIST TO-254 3POS GOLD

Sullins Connector Solutions

0 -
TMJ03DKSD-S1512

数据表

- Tube Active Transistor, TO-254 3 (Rectangular) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Flange 0.150" (3.81mm) Solder 0.150" (3.81mm) -50°C ~ 175°C Gold Polyphenylene Sulfide (PPS) 30.0µin (0.76µm) Beryllium Copper
40-6508-301

40-6508-301

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6508-301

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
614-87-121-13-061112

614-87-121-13-061112

CONN SOCKET PGA 121POS GOLD

Preci-Dip

0 -
614-87-121-13-061112

数据表

614 Bulk Active PGA 121 (13 x 13) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0407-G-2

HLS-0407-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0407-G-2

数据表

HLS Bulk Active SIP 28 (4 x 7) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
116-41-322-41-001000

116-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-322-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-422-41-001000

116-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-422-41-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-322-41-001000

116-91-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-322-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-422-41-001000

116-91-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-422-41-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-91-648-41-003000

115-91-648-41-003000

SOCKET IC OPEN LOWPRO .600 48POS

Mill-Max Manufacturing Corp.

0 -
115-91-648-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Thermoplastic 200.0µin (5.08µm) Brass Alloy
115-41-648-41-003000

115-41-648-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-648-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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