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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
18-822-90

18-822-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-822-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
26-8450-310C

26-8450-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8450-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
26-8500-310C

26-8500-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8500-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
111-41-642-41-001000

111-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-642-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-642-41-001000

111-91-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-642-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-320-41-001000

614-41-320-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-320-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-420-41-001000

614-41-420-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-420-41-001000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-320-41-001000

614-91-320-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-320-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-420-41-001000

614-91-420-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-420-41-001000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APO-640-T-H

APO-640-T-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-640-T-H

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
123-13-210-41-001000

123-13-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-210-41-001000

数据表

123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
114-41-636-41-117000

114-41-636-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-636-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-91-636-41-117000

114-91-636-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-636-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
18-823-90

18-823-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-823-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
210-13-322-41-001000

210-13-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-13-322-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
210-13-422-41-001000

210-13-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-13-422-41-001000

数据表

210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
614-41-318-41-001000

614-41-318-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-318-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-318-41-001000

614-91-318-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-318-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-628-T-B

APA-628-T-B

ADAPTER PLUG

Samtec Inc.

0 -
APA-628-T-B

数据表

APA Bulk Active - 28 (2 x 14) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
110-41-640-41-105000

110-41-640-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-640-41-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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