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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APA-628-G-J

APA-628-G-J

ADAPTER PLUG

Samtec Inc.

0 -
APA-628-G-J

数据表

APA Bulk Active - 28 (2 x 14) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
111-41-640-41-001000

111-41-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-640-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-640-41-001000

111-91-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-640-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-13-314-41-780000

104-13-314-41-780000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-314-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
16-C280-20

16-C280-20

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-C280-20

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
24-6508-202

24-6508-202

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6508-202

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
146-93-422-41-012000

146-93-422-41-012000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
146-93-422-41-012000

数据表

146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-43-422-41-012000

146-43-422-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-43-422-41-012000

数据表

146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0930-T-T

APH-0930-T-T

APH-0930-T-T

Samtec Inc.

0 -
APH-0930-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0530-T-T

APH-0530-T-T

APH-0530-T-T

Samtec Inc.

0 -
APH-0530-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0630-T-T

APH-0630-T-T

APH-0630-T-T

Samtec Inc.

0 -
APH-0630-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1230-T-T

APH-1230-T-T

APH-1230-T-T

Samtec Inc.

0 -
APH-1230-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0230-T-T

APH-0230-T-T

APH-0230-T-T

Samtec Inc.

0 -
APH-0230-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0730-T-T

APH-0730-T-T

APH-0730-T-T

Samtec Inc.

0 -
APH-0730-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1130-T-T

APH-1130-T-T

APH-1130-T-T

Samtec Inc.

0 -
APH-1130-T-T

数据表

* - Active - - - - - - - - - - - - - - -
317-43-118-41-005000

317-43-118-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

0 -
317-43-118-41-005000

数据表

317 Bulk Active SIP 18 (1 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-93-316-11-480000

605-93-316-11-480000

SOCKET CARRIER LOWPRO .300 16POS

Mill-Max Manufacturing Corp.

0 -
605-93-316-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-43-316-11-480000

605-43-316-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-43-316-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
17-0501-21

17-0501-21

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0501-21

数据表

501 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
24-4518-10E

24-4518-10E

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-4518-10E

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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