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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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605-43-320-11-480000SKT CARRIER LOWPRO |
0 | - |
|
数据表 |
605 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
605-43-420-11-480000SKT CARRIER LOWPRO |
0 | - |
|
数据表 |
605 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
126-93-210-41-002000CONN IC DIP SOCKET 10POS GOLD |
0 | - |
|
数据表 |
126 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
126-43-210-41-002000CONN IC SKT DBL |
0 | - |
|
数据表 |
126 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
210-11-628-41-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
114-93-328-41-117000CONN IC DIP SOCKET 28POS GOLD |
0 | - |
|
数据表 |
114 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
114-93-428-41-117000CONN IC DIP SOCKET 28POS GOLD |
0 | - |
|
数据表 |
114 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
114-93-628-41-117000CONN IC DIP SOCKET 28POS GOLD |
0 | - |
|
数据表 |
114 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
114-43-328-41-117000CONN IC SKT DBL |
0 | - |
|
数据表 |
114 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
114-43-428-41-117000CONN IC SKT DBL |
0 | - |
|
数据表 |
114 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
114-43-628-41-117000CONN IC SKT DBL |
0 | - |
|
数据表 |
114 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
612-43-210-41-003000SKT CARRIER SOLDRTL |
0 | - |
|
数据表 |
612 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
612-93-210-41-003000SKT CARRIER SOLDRTL |
0 | - |
|
数据表 |
612 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
ICF-328-STL-O.100" SURFACE MOUNT SCREW MACHIN |
0 | - |
|
数据表 |
ICF | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
ICF-628-STL-I.100" SURFACE MOUNT SCREW MACHIN |
0 | - |
|
数据表 |
ICF | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
605-93-318-11-480000SOCKET CARRIER LOWPRO .300 18POS |
0 | - |
|
数据表 |
605 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
605-43-318-11-480000SKT CARRIER LOWPRO |
0 | - |
|
数据表 |
605 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-93-316-31-018000SOCKET CARRIER LOWPRO .300 16POS |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
614-43-316-31-018000SKT CARRIER PGA |
0 | - |
|
数据表 |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 30.0µin (0.76µm) | Brass Alloy |
|
HLS-0218-G-2.100" SCREW MACHINE SOCKET ARRAY |
0 | - |
|
数据表 |
HLS | Tube | Active | SIP | 36 (2 x 18) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
