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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
26-8350-310C

26-8350-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8350-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
26-8530-310C

26-8530-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8530-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
26-8900-310C

26-8900-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8900-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
26-8975-310C

26-8975-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8975-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
26-8984-310C

26-8984-310C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-8984-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
APH-0428-T-R

APH-0428-T-R

APH-0428-T-R

Samtec Inc.

0 -
APH-0428-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1828-T-R

APH-1828-T-R

APH-1828-T-R

Samtec Inc.

0 -
APH-1828-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0528-T-R

APH-0528-T-R

APH-0528-T-R

Samtec Inc.

0 -
APH-0528-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1428-T-R

APH-1428-T-R

APH-1428-T-R

Samtec Inc.

0 -
APH-1428-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1528-T-R

APH-1528-T-R

APH-1528-T-R

Samtec Inc.

0 -
APH-1528-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1928-T-R

APH-1928-T-R

APH-1928-T-R

Samtec Inc.

0 -
APH-1928-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0628-T-R

APH-0628-T-R

APH-0628-T-R

Samtec Inc.

0 -
APH-0628-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0328-T-R

APH-0328-T-R

APH-0328-T-R

Samtec Inc.

0 -
APH-0328-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1728-T-R

APH-1728-T-R

APH-1728-T-R

Samtec Inc.

0 -
APH-1728-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0828-T-R

APH-0828-T-R

APH-0828-T-R

Samtec Inc.

0 -
APH-0828-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1328-T-R

APH-1328-T-R

APH-1328-T-R

Samtec Inc.

0 -
APH-1328-T-R

数据表

* - Active - - - - - - - - - - - - - - -
117-47-430-41-005000

117-47-430-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
117-47-430-41-005000

数据表

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-93-158-41-013000

346-93-158-41-013000

CONN SOCKET SIP 58POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-158-41-013000

数据表

346 Bulk Active SIP 58 (1 x 58) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-158-41-013000

346-43-158-41-013000

CONN SOCKET SIP 58POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-158-41-013000

数据表

346 Bulk Active SIP 58 (1 x 58) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
18-820-90

18-820-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-820-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
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