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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-47-306-41-001000

116-47-306-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-306-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-6556-10

28-6556-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6556-10

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
ICA-640-SGG-L

ICA-640-SGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-SGG-L

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
614-41-306-31-018000

614-41-306-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-306-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-306-31-018000

614-91-306-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-306-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-306-41-008000

116-93-306-41-008000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-306-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-306-41-008000

116-43-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-306-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
10-0511-11

10-0511-11

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0511-11

数据表

511 Tube Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
APH-1822-T-R

APH-1822-T-R

APH-1822-T-R

Samtec Inc.

0 -
APH-1822-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1422-T-R

APH-1422-T-R

APH-1422-T-R

Samtec Inc.

0 -
APH-1422-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0522-T-R

APH-0522-T-R

APH-0522-T-R

Samtec Inc.

0 -
APH-0522-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1022-T-R

APH-1022-T-R

APH-1022-T-R

Samtec Inc.

0 -
APH-1022-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1122-T-R

APH-1122-T-R

APH-1122-T-R

Samtec Inc.

0 -
APH-1122-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1622-T-R

APH-1622-T-R

APH-1622-T-R

Samtec Inc.

0 -
APH-1622-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0722-T-R

APH-0722-T-R

APH-0722-T-R

Samtec Inc.

0 -
APH-0722-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0322-T-R

APH-0322-T-R

APH-0322-T-R

Samtec Inc.

0 -
APH-0322-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1322-T-R

APH-1322-T-R

APH-1322-T-R

Samtec Inc.

0 -
APH-1322-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1222-T-R

APH-1222-T-R

APH-1222-T-R

Samtec Inc.

0 -
APH-1222-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0422-T-R

APH-0422-T-R

APH-0422-T-R

Samtec Inc.

0 -
APH-0422-T-R

数据表

* - Active - - - - - - - - - - - - - - -
110-47-424-41-001000

110-47-424-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-424-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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